C09J 2423/001
In the barrier layer
Official title: in the barrier layer
C09J2423/001 (In the barrier layer) appears on 10 US grants and 12 published applications in this corpus.
Search patents in C09J- Granted patents
- 10
- Published applications
- 12
- Assignees
- 11
- Inventors
- 41
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 1 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 1 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 2 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 1 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Coextruded polymeric adhesive article9 Jun 2026US 12,649,868 B23M Innovative Properties Company
- Adhesive sheet18 Nov 2025US 12,473,466 B2Lintec Corporation
- Nanoclay filled barrier adhesive compositions11 Aug 2020US 10,738,224 B23M Innovative Properties Company
- Multi-layered film and the use thereof15 Aug 2017US 9,732,254 B2BASF SE
- Multi-layer dry paint decorative laminate having discoloration prevention barrier1 Jun 2010US 7,727,607 B2The Procter & Gamble Company
- Hot-Melt, Pressure-Sensitive Adhesive With A Wide Range Of Application-Temperature8 Oct 2026US 2026/0308424 A1Henry Company, LLC
- Self-adhering roofing underlayment27 Nov 2025US 2025/0361725 A1Arista Construction Systems FZE
- Adhesive sheet2 Jan 2025US 2025/0002760 A1Lintec Corporation
- Adhesive sheet15 Feb 2024US 2024/0052209 A1Lintec Corporation
- Coextruded polymeric adhesive article6 Oct 2022US 2022/0315807 A13M Innovative Properties Company
Most cited
By later US patents
- Method for dicing a semiconductor wafer44US 4,720,317 ABando Chemical Industries, Ltd. · 1988
- Pressure sensitive adhesive film with barrier layer28US 4,968,559 ABando Chemical Industries, Ltd. · 1990
- Pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same18US 4,913,960 ABando Chemical Industries, Ltd. · 1990
- Pressure sensitive adhesives with reducible adhesive force using radiation, and films therewith9US 4,818,621 ABando Chemical Industries, Ltd. · 1989
- Correction tape having dye migration blocking properties8US 6,331,352 B1BIC Corporation · 2001