C09J 2400/10
Presence of inorganic materials
C09J2400/10 (Presence of inorganic materials) appears on 949 US grants and 1,526 published applications in this corpus.
Search patents in C09J- Granted patents
- 949
- Published applications
- 1,526
- Assignees
- 724
- Inventors
- 3,644
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 4 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 7 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 8 | 0 |
| 1992 | 7 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 9 | 0 |
| 1996 | 8 | 0 |
| 1997 | 7 | 0 |
| 1998 | 5 | 0 |
| 1999 | 10 | 0 |
| 2000 | 8 | 0 |
| 2001 | 15 | 5 |
| 2002 | 11 | 23 |
| 2003 | 9 | 30 |
| 2004 | 23 | 32 |
| 2005 | 14 | 25 |
| 2006 | 12 | 20 |
| 2007 | 11 | 20 |
| 2008 | 6 | 36 |
| 2009 | 7 | 31 |
| 2010 | 13 | 36 |
| 2011 | 9 | 31 |
| 2012 | 13 | 43 |
| 2013 | 23 | 48 |
| 2014 | 23 | 49 |
| 2015 | 22 | 46 |
| 2016 | 28 | 44 |
| 2017 | 33 | 83 |
| 2018 | 32 | 95 |
| 2019 | 62 | 99 |
| 2020 | 55 | 105 |
| 2021 | 60 | 97 |
| 2022 | 57 | 120 |
| 2023 | 56 | 114 |
| 2024 | 98 | 121 |
| 2025 | 75 | 87 |
| 2026 | 59 | 86 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Curable fluoropolyether adhesive composition and optical part6 Oct 2026US 12,753,333 B2Shin-Etsu Chemical Co., Ltd.
- Lightweight rf shielding conductive elastomeric tape29 Sep 2026US 12,747,376 B2Swift Textile Metalizing LLC
- Metal thin film substrate, transparent display comprising same, method for patterning metal thin film substrate, and method for manufacturing transparent display22 Sep 2026US 12,741,445 B2Dongwoo Fine-Chem Co., Ltd.
- Resin composition, polyurethane adhesive agent, and layered product22 Sep 2026US 12,742,099 B2Dainichiseika Color & Chemicals Mfg. Co., Ltd.
- Mount tape having an inner support layer between adhesive layers for semiconductor device assembly22 Sep 2026US 12,745,601 B2Micron Technology, Inc.
- Adhesive resin composition-coated electrical steel sheet and method for producing same8 Oct 2026US 2026/0308418 A1Nippon Steel Corporation
- Adhesive resin composition-coated electrical steel sheet and method for producing same8 Oct 2026US 2026/0308419 A1Nippon Steel Corporation
- Resin composition, adhesive member, and electronic apparatus including the adhesive member8 Oct 2026US 2026/0308420 A1Samsung Display Co., Ltd.
- Adhesive film, adhesive film with metal layer, wiring formation member, formation method for wiring layer, and wired member1 Oct 2026US 2026/0297391 A1Resonac Corporation
- Thermally conductive chemically curable composition24 Sep 2026US 2026/0286102 A1Sika Technology AG
Most cited
By later US patents
- Random surface protrusions on an implantable device117US 5,507,815 ACycam, Inc. · 1996
- Releasable, self-detackifying laminate construction113US 4,398,985 AKimberly-Clark Corporation · 1983
- Structures, systems and methods for joining articles and materials and uses therefor104US 7,074,294 B2Nanosys, Inc. · 2006
- Structures, systems and methods for joining articles and materials and uses therefor92US 7,056,409 B2Nanosys, Inc. · 2006
- Method of production of a surface adapted to promote adhesion73US 5,258,098 ACycam, Inc. · 1993