Thermally conductive chemically curable composition

Abstract

A chemically curable composition, including: at least one chemically curable matrix; more than 70 wt.-%, based on the total composition, of at least one thermally conductive filler; optionally additives, in particular selected from curing catalysts, accelerators, plasticizers, organosilanes, stabilizers, and colorants; wherein the thermally conductive filler is surface-coated by silanzation using a mixture of at least one organosilane OS1 according to R1—Si(OR3)3 and at least one organosilane OS2 according to R2—Si(OR3)3, wherein R1 is a linear or branched C2 to C20 alkyl or alkenyl group optionally having cyclic and/or aromatic moieties, and wherein R2 is a polyether group, and wherein R3 is a methyl or ethyl group. The composition shows low viscosity and improved applicability alongside with exceptionally high filler levels and thus excellent thermal conductivity and is particularly suitable as adhesive, gap filler, or sealant suitable for e-coat applications and battery bonding especially in electric automobile battery assembly.

Dependencies are inferred from the claim text.