C09J 2203/362
Applications of adhesives in processes or use of adhesives in the form
Official title: for the fabrication of shoes
C09J2203/362 (Applications of adhesives in processes or use of adhesives in the form) appears on 7 US grants and 17 published applications in this corpus.
Search patents in C09J- Granted patents
- 7
- Published applications
- 17
- Assignees
- 7
- Inventors
- 27
- Latest grant
- 7 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2019 | 0 | 1 |
| 2020 | 0 | 2 |
| 2021 | 0 | 3 |
| 2022 | 2 | 3 |
| 2023 | 1 | 3 |
| 2024 | 1 | 1 |
| 2025 | 3 | 1 |
| 2026 | 0 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Dot bonding shoe insole using adhesive resin mixed with hydrophobic nano-silica and manufacturing thereof7 Oct 2025US 12,433,369 B2
- Composite structures including a bonding layer and methods of making the composite structure17 Jun 2025US 12,329,237 B2NIKE, Inc.
- Method of manufacturing a footwear25 Feb 2025US 12,232,565 B2ECCO Sko A/S
- Dot bonding shoe insole using adhesive resin mixed with hydrophobic nano-silica and manufacturing thereof30 Jan 2024US 11,882,900 B2
- Curable heat-seal adhesives for bonding polymers3 Jan 2023US 11,542,354 B2Arkema France
- Systems and methods for protection of shoes and use thereof3 Sep 2026US 2026/0256247 A1
- Silk-based adhesive platform for footwear and fashion18 Jun 2026US 2026/0167854 A1
- Thermoplastic adhesive film15 Jan 2026US 2026/0015526 A1Far Eastern New Century Corporation
- Pressure sensitive decal24 Apr 2025US 2025/0127257 A1eMCee Apparel, L.L.C.
- Method for attaching adhesive to shoe sole2 May 2024US 2024/0138524 A1Pumma Technology Co., Ltd.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.