Dot bonding shoe insole using adhesive resin mixed with hydrophobic nano-silica and manufacturing thereof

A method for manufacturing a dot bonding shoe insole using an adhesive resin containing hydrophobic nano-silica, the method comprising:

• melting adhesive resin, the adhesive resin comprising a resin selected from the group consisting of thermoplastic polyurethane (TPU) and ethylene vinyl acetate (EVA), the adhesive resin further comprising hydrophobic nano-silica in a range of 0.2 to 5 phr;
• applying the adhesive resin to a surface of a transfer roller in which an intaglio dot pattern is formed in a shoe insole shape such that the adhesive resin is applied to the surface of the transfer roller with the intaglio dot pattern;
• removing adhesive resin applied to an area which is not part of the intaglio dot pattern using a scraper;
• transferring the adhesive resin applied to the intaglio dot pattern of the surface of the transfer roller to either one of a foam or a fabric, thereby forming a dot pattern adhesive resin layer on a surface of the foam or the fabric;
• bonding the foam and the fabric by compressing;
• and
• cutting the bonded foam and fabric formed by the bonding step out in the shoe insole shape, thereby forming the dot bonding shoe insole,
• wherein the hydrophobic nano-silica forms aggregates of the hydrophobic nano-silica having an average nano-silica aggregation size of about 100 to about 1200 nm in the dot pattern adhesive resin layer on the surface of the foam or the fabric.