C09J 165/04
Polyxylylenes
C09J165/04 (Polyxylylenes) appears on 4 US grants and 5 published applications in this corpus.
Search patents in C09J- Granted patents
- 4
- Published applications
- 5
- Assignees
- 7
- Inventors
- 19
- Latest grant
- 16 Aug 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 2 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
By publication year.
Recent patents
- Liquid hydrocarbon-based copolymers bearing two cyclocarbonate ester end groups16 Aug 2022US 11,414,516 B2Bostik SA
- Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition25 May 2021US 11,016,385 B2Industrial Technology Research Institute
- Cyanic acid ester compound and method for producing same, resin composition, and cured product8 Jan 2019US 10,174,149 B2Mitsubishi Gas Chemical Company, Inc.
- Vulcanizable adhesive composition24 Jul 2007US 7,247,388 B2Nok Corporation
- Liquid hydrocarbon-based copolymers bearing two cyclocarbonate ester end groups13 Aug 2020US 2020/0255587 A1Bostik SA
- Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition27 Feb 2020US 2020/0064736 A1Industrial Technology Research Institute
- Articles of controllably bonded sheets and methods for making same20 Jun 2019US 2019/0184686 A1Corning Incorporated
- Cyanic acid ester compound and method for producing same, resin composition, and cured product10 Aug 2017US 2017/0226263 A1Mitsubishi Gas Chemical Company, Inc.
- Vulcanizable adhesive composition29 Sep 2005US 2005/0215712 A1Nok Corporation
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.