Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition
AssigneeIndustrial Technology Research Institute
InventorsYi-Chi Yang, Shou-Yi Ho, Kuo-Chan Chiou
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Abstract
The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.
Claims16
A photosensitive adhesive composition, comprising:
- 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group;
- 10 parts by weight to 90 parts by weight of a tertiary amine polymer;
- and
- 0.5 parts by weight to 10 parts by weight of a photoacid initiator,
- wherein a weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000,
- wherein the tertiary amine polymer has a structure represented by formula (1)
- wherein R1 and R2 are respectively a methyl group, an ethyl group, a propyl group, or an isopropyl group, and R3 is a C1 to C5 alkylene group,
- R4 is
- a number n of a repeating unit is an integer between 8 and 132, and * is an end bonded to R3.
Dependencies are inferred from the claim text.