C09J 165/02
Polyphenylenes
C09J165/02 (Polyphenylenes) appears on 10 US grants and 17 published applications in this corpus.
Search patents in C09J- Granted patents
- 10
- Published applications
- 17
- Assignees
- 13
- Inventors
- 37
- Latest grant
- 6 Aug 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 2 |
| 2014 | 1 | 1 |
| 2015 | 2 | 2 |
| 2016 | 1 | 4 |
| 2017 | 2 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 2 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Methods for enhancing the bonding strength of thermoset adhesives and sealants via disulfide dynamic chemistry6 Aug 2024US 12,054,651 B2Northwestern University
- Polyarylether ketone imide sulfone adhesives10 Dec 2019US 10,501,665 B2The Boeing Company
- Polyarylether ketone imide sulfone adhesives22 May 2018US 9,976,063 B2The Boeing Company
- Composite optical reflective film and preparation method therefor15 Aug 2017US 9,732,233 B2Ningbo Solartron Technology Co., Ltd.
- Low surface energy adhesive21 Feb 2017US 9,574,117 B23M Innovative Properties Company
- Low dielectric resin composition, adhesiveness-imparting agent, low dielectric adhesive composition, low dielectric adhesive molded product, low dielectric adhesive, and laminate3 Sep 2026US 2026/0258237 A1Mitsui Chemicals, Inc.
- Methods for enhancing the bonding strength of thermoset adhesives and sealants via disulfide dynamic chemistry20 Jul 2023US 2023/0227702 A1Northwestern University
- Adhesive composition, thermosetting adhesive sheet, and printed wiring board11 Feb 2021US 2021/0040360 A1Dexerials Corporation
- Methods for enhancing the bonding strength of thermoset adhesives and sealants via disulfide dynamic chemistry14 Jan 2021US 2021/0009872 A1Northwestern University
- Polyarylether ketone imide sulfone adhesives22 Nov 2018US 2018/0334598 A1The Boeing Company
Most cited
By later US patents
- Polyarylether ketone imide sulfone adhesives118US 9,976,063 B2The Boeing Company · 2018
- Side-chain and end-group modified poly-p-phenylene oligomers16US 9,023,954 B1The United States of America as represented by the Secretary of the Navy · 2015
- Low surface energy adhesive2US 9,574,117 B23M Innovative Properties Company · 2017
- Electroconductive adhesive and adhesive article using the same1US 7,297,401 B2Sunny Sealing Co., Ltd. · 2007
- Process for the acetylation of wood elements1US 8,865,318 B2Titan Wood Limited · 2014