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US 2021/0040360 A1Published application
Adhesive composition, thermosetting adhesive sheet, and printed wiring board
AssigneeDexerials Corporation
InventorsJun YAMAMOTO, Toshiyuki MINEGISHI, Kazuhiro DATE
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Abstract
An adhesive composition having a low dielectric constant and dielectric loss tangent and an excellent folding endurance includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent.
Claims20
An adhesive composition, comprising:
- with respect to the total of 100 parts by mass of the adhesive composition,
- 75 to 90 parts by mass of a styrene elastomer,
- 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end;
- and
- totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent,
- wherein the styrene content of the styrene elastomer is 5 to 25%.
3 more elements
Dependencies are inferred from the claim text.