C09J 159/02
Polyacetals containing polyoxymethylene sequences only
C09J159/02 (Polyacetals containing polyoxymethylene sequences only) appears on 2 US grants and 3 published applications in this corpus.
Search patents in C09J- Granted patents
- 2
- Published applications
- 3
- Assignees
- 3
- Inventors
- 5
- Latest grant
- 31 Dec 2013
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 3 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 2 | 0 |
By publication year.
Recent patents
- Heat-bondable composite fiber, process for producing the same, and fibrous mass29 Jul 2010US 2010/0190406 A1Daiwabo Holdings Co., Ltd.
- Method for adhesion of resin material comprising oxymethylene polymer, and structure18 Feb 2010US 2010/0041854 A1Mitsubishi Gas Chemical Company, Inc.
- Method for bonding resin materials containing oxymethylene polymer and structures28 Jan 2010US 2010/0021752 A1Mitsubishi Gas Chemical Company, Inc.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.