Method for bonding resin materials containing oxymethylene polymer and structures
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsAkira Okamura, Satoshi Nagai
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Abstract
Provided are a method of bonding resin materials for bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), and a structure obtained by the bonding method. The method includes preparing as the resin material (Y) a low-melting-point oxymethylene-based polymer (B) having a melting point lower than that of the oxymethylene-based polymer (A) by 5 to 50° C., or preparing as the resin material (Y) the resin material (X) or another resin material, and providing the low-melting-point oxymethylene-based polymer (B) between the resin material (Y) and the resin material (X) and heating resin materials.
Claims12
A method of bonding resin materials comprising a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), said method comprising:
- heat treating the resin materials (X) and (Y) such that bonding of the resin material (X) and the resin material (Y) occurs;
- wherein:
- the resin material (Y) is a low-melting-point oxymethylene-based polymer (B) having a melting point lower than the melting point of the oxymethylene-based polymer (A) by 5 to 50° C.;
- or
- the resin material (Y) is a material identical to or different from the resin material (X) and the low-melting-point oxymethylene-based polymer (B) is provided between the resin material (Y) and the resin material (X);
- and
- wherein the heat treating is performed at a temperature lower than the melting point of the oxymethylene-based polymer (A) and equal to or higher than a temperature obtained by subtracting 20° C. from the melting point of the low-melting-point oxymethylene-based polymer (B).
Dependencies are inferred from the claim text.