Method for adhesion of resin material comprising oxymethylene polymer, and structure

A method of bonding resin materials for bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), comprising:

• preparing an oxymethylene-based polymer composition (B) as the resin material (Y), and the resin material (X) containing the oxymethylene-based polymer (A);
• or
• preparing the resin material (X) containing the oxymethylene-based polymer (A) and a resin material identical to the resin material (X) or another resin material as the resin material (Y), and providing the oxymethylene-based polymer composition (B) between the resin material (Y) and the resin material (X);
• and
• bonding the resin material (X) and the resin material (Y) by placing resin material (X) and resin material (Y) in contact with one another, either directly or by way of oxymethylene-based polymer composition (B) therebetween, and heating the resin materials,
• wherein the oxymethylene-based polymer (A) comprises a repeating unit represented by the following general formula (1) and is a copolymerized product of trioxane and one or more kinds of comonomers in an amount of 0.5 to 30.0 parts by mass with respect to 100 parts by mass of trioxane,
• the oxymethylene-based polymer composition (B) comprises a repeating unit represented by the following general formula (1) and is a copolymerized product of trioxane and one or more kinds of comonomers in an amount of 5.0 to 50.0 parts by mass with respect to 100 parts by mass of trioxane:
• wherein R1 and R2 each, independently, represent a hydrogen atom, an alkyl group, an organic group having an alkyl group, a phenyl group, or an organic group having a phenyl group, and m represents an integer of 1 to 6, and
• the oxymethylene-based polymer composition (B) satisfies the following conditions (1) and (2):
• (1) the oxymethylene-based polymer composition (B) has a melting point lower than a melting point of the oxymethylene-based polymer (A), and a difference in melting point between the composition and the polymer is smaller than 5° C.;
• and
• (2) 50% or more of a peak area determined from a peak showing a molten state of the oxymethylene-based polymer composition (B) measured by DSC is present in a temperature region lower than a peak temperature of the oxymethylene-based polymer (A) by 5° C. or more.