C08L 55/04
Polyadducts obtained by the diene synthesis
C08L55/04 (Polyadducts obtained by the diene synthesis) appears on 6 US grants and 5 published applications in this corpus.
Search patents in C08L- Granted patents
- 6
- Published applications
- 5
- Assignees
- 6
- Inventors
- 22
- Latest grant
- 18 Jun 2013
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition18 Jun 2013US 8,465,666 B2Panasonic Corporation
- Non-asbestos friction materials22 Jul 2003US 6,596,789 B2Nisshinbo Industries, Inc.
- Graft polymers with improved surface gloss4 Feb 1997US 5,599,862 A
- Process for producing novel hydrogenated resin from five-member cyclic compounds having a conjugated double bond and/or Diels-Alder addition products thereof6 Dec 1983US 4,419,497 ANippon Oil Co., Ltd.
- Novel hydrogenated resin produced from five-member cyclic compounds having a conjugated double bond and/or diels-alder addition products thereof1 Nov 1983US 4,413,067 ANippon Oil Co., Ltd.
- Resin composition, article made therefrom, and use thereof2 Jul 2026US 2026/0184912 A1Elite Electronic Material (Kunshan) Co., Ltd.
- Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition2 Feb 2012US 2012/0025132 A1Panasonic Corporation
- Epoxy adhesive compositions with high mechanical strength over a wide temperature range22 Dec 2011US 2011/0313082 A1
- Flameproofed impact-modified polycarbonate composition25 Jun 2009US 2009/0160103 A1Bayer MaterialScience AG
- Non-asbestos friction materials17 Jan 2002US 2002/0006981 A1Nisshinbo Industries, Inc.
Most cited
By later US patents
- Adducts containing succinic groups attached to elastomeric copolymers16US 4,010,223 AE. I. Du Pont de Nemours and Company · 1977
- Novel hydrogenated resin produced from five-member cyclic compounds having a conjugated double bond and/or diels-alder addition products thereof15US 4,413,067 ANippon Oil Co., Ltd. · 1983
- Process for producing novel hydrogenated resin from five-member cyclic compounds having a conjugated double bond and/or Diels-Alder addition products thereof13US 4,419,497 ANippon Oil Co., Ltd. · 1983
- Non-asbestos friction materials5US 6,596,789 B2Nisshinbo Industries, Inc. · 2003
- Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition4US 8,465,666 B2Panasonic Corporation · 2013