Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition
AssigneePanasonic Corporation
InventorsToshiyuki Asahi, Yukihiro Shimasaki, Koji Shimoyama
Life of this patent
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Abstract
A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.
Claims26
A thermally conductive composition including a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler, a content by percentage of the inorganic filler in the thermally conductive composition being 66% or more by volume, and 90% or less by volume,
- the thermally conductive composition comprising:
- a main portion in which the inorganic filler is mainly contained;
- and
- a surface layer portion which is made mainly of the crystalline epoxy resin component and is formed on the main portion to be continuous to the main portion,
- wherein a front surface of the surface layer portion is specified by at least one of:
- an arithmetical average roughness Ra of 3000 Å or less;
- a maximum height Ry of 15000 Å or less;
- and
- a 20-degree glossiness of 70 or more.
A process for producing a thermally conductive composition, comprising:
- (A) preparing a mixture of a main agent containing a crystalline epoxy resin component which is not yet cured, a curing agent, and an inorganic filler;
- and
- (B) heating the mixture to not lower than the crystallization temperature of the crystalline epoxy resin component, and curing the main agent to form a cured thermosetting resin,
- wherein the content by percentage of the inorganic filler is 66% or more by volume and 90% or less by volume, and
- in the step (B), a main portion in which the inorganic filler is mainly contained is formed, and a surface layer portion made mainly of the crystalline epoxy resin component to be continuous to the main portion is formed on the main portion
- in such a manner that the surface layer portion has a front surface having at least either a surface roughness specified at least either by an arithmetical average roughness Ra of 3000 Å or less, or by a maximum height Ry of 15000 Å or less, or a 20-degree glossiness of 70 or more.
Dependencies are inferred from the claim text.