C08K 5/5475
Containing at least one c≡n bond
Official title: containing at least one C≡N bond
C08K5/5475 (Containing at least one c≡n bond) appears on 21 US grants and 20 published applications in this corpus.
Search patents in C08K- Granted patents
- 21
- Published applications
- 20
- Assignees
- 19
- Inventors
- 85
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 2 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 3 | 1 |
| 2019 | 0 | 0 |
| 2020 | 1 | 5 |
| 2021 | 0 | 2 |
| 2022 | 2 | 1 |
| 2023 | 1 | 2 |
| 2024 | 2 | 1 |
| 2025 | 0 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Polyamide resin composition, molded article obtained by molding same, and methods for producing those16 Jun 2026US 12,655,253 B2Toray Industries, Inc.
- Coupled polymer products, methods of making and compositions containing11 Jun 2024US 12,006,422 B2Bridgestone Corporation
- Silyl pseudohalides for silicon containing films19 Mar 2024US 11,932,940 B2APPLIED Materials.Inc.
- Condensation curable composition19 Sep 2023US 11,760,900 B2Momentive Performance Materials Inc.
- Resin material, method for producing resin material, and laminate4 Oct 2022US 11,459,443 B2Sekisui Chemical Co., Ltd.
- Substrates with resin composition adhered thereto and methods for improving adhesion to a substrate9 Oct 2025US 2025/0313681 A1
- Polyamide resin composition, molded article obtained by molding same, and methods for producing those10 Apr 2025US 2025/0115712 A1Toray Industries, Inc.
- Process for making cyanoethyltrimethoxysilane24 Oct 2024US 2024/0352050 A1Dow Silicones Corporation
- Method for producing organyloxysilane-terminated polymers2 Nov 2023US 2023/0348672 A1Wacker Chemie AG
- Condensation curable composition27 Apr 2023US 2023/0127458 A1Momentive Performance Materials Inc.
Most cited
By later US patents
- Ultraviolet light absorbing agents and compositions and articles containing same56US 4,278,804 AGeneral Electric Company · 1981
- Ultraviolet light absorbing agents and compositions and articles containing same14US 4,374,674 AGeneral Electric Company · 1983
- Ultraviolet light absorbing compositions11US 4,390,660 AGeneral Electric Company · 1983
- One component room temperature vulcanizing silicone elastomer with improved primerless adhesion to polycarbonate10US 5,232,982 AGeneral Electric Company · 1993
- Low VOC-solvent based mold release agent and curable mold release compositions based thereon10US 7,462,668 B2Henkel Corporation · 2008