Polyamide resin composition, molded article obtained by molding same, and methods for producing those
AssigneeToray Industries, Inc.
InventorsMasaru Akita, Masayuki Moriyama, Yuki Furukawa
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AssigneeToray Industries, Inc.
InventorsMasaru Akita, Masayuki Moriyama, Yuki Furukawa
Estimating the term…
The present invention pertains to: a polyamide resin composition obtained by compounding, with respect to 100 parts by weight of a polyamide resin (A), 0.01-12 parts by weight of a silicone resin (B) and 0.01-5 parts by weight of a silane coupling agent (C) having at least one functional group selected from the group consisting of an isocyanate group, an epoxy group, and an acid anhydride group; a molded article thereof; and methods for producing the composition and the molded article. Provided is a polyamide resin composition which, even if the polyamide resin composition contains a silicone resin as an impurity, can suppress detachment of the silicone resin from a molded article obtained through injection molding of the polyamide resin composition and can suppress adhesion of the silicone resin to the surface of a mold during molding, and a molded article from which also can have excellent mechanical properties.
A method for producing a polyamide resin composition compounded with 0.01-12 parts by weight of a silicone resin (B) and 0.01-5 parts by weight of a silane coupling agent (C) having at least one functional group selected from the group consisting of an isocyanate group, an epoxy group, and an acid anhydride group, with respect to 100 parts by weight of a polyamide resin (A), comprising the steps of:
A method for producing a polyamide resin composition compounded with 0.01-12 parts by weight of a silicone resin (B), 0.01-5 parts by weight of a silane coupling agent (C) having at least one functional group selected from the group consisting of an isocyanate group, an epoxy group, and an acid anhydride group, with respect to 100 parts by weight of a polyamide resin (A), and 0.01 to 5 parts by weight of an ammonium salt (D) comprising a dicarboxylic acid having a carbon number of 6 to 12 and ammonia, comprising the steps of:
A method for producing a polyamide resin composition compounded with 0.01-12 parts by weight of a silicone resin (B), 0.01-5 parts by weight of a silane coupling agent (C) having at least one functional group selected from the group consisting of an isocyanate group, an epoxy group, and an acid anhydride group, with respect to 100 parts by weight of a polyamide resin (A), and 0.01 to 5 parts by weight of an acid anhydride (E), comprising the steps of:
Dependencies are inferred from the claim text.