C08J 2325/16
Homopolymers or copolymers of alkyl-substituted styrenes
C08J2325/16 (Homopolymers or copolymers of alkyl-substituted styrenes) appears on 37 US grants and 53 published applications in this corpus.
Search patents in C08J- Granted patents
- 37
- Published applications
- 53
- Assignees
- 42
- Inventors
- 147
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 2 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 4 | 4 |
| 2017 | 0 | 1 |
| 2018 | 2 | 2 |
| 2019 | 0 | 2 |
| 2020 | 1 | 5 |
| 2021 | 3 | 8 |
| 2022 | 5 | 5 |
| 2023 | 4 | 1 |
| 2024 | 4 | 6 |
| 2025 | 4 | 6 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition, insulating resin film and use thereof1 Sep 2026US 12,723,137 B2Shengyi Technology Co., Ltd.
- Polymer compositions and products formed therewith30 Dec 2025US 12,509,572 B2Church & Dwight Co., Inc.
- Polymer compositions and products formed therewith16 Sep 2025US 12,415,908 B2Church & Dwight Co., Inc.
- Anionic electrochemical compressor and refrigeration system employing same26 Aug 2025US 12,398,927 B2Ffi Ionix IP, Inc.
- Geopolymer composite and expandable vinyl aromatic polymer granulate and expanded vinyl aromatic polymer foam comprising the same14 Jan 2025US 12,195,397 B2Synthos S.A.
- Resin composition, prepreg, resin film, metal-clad laminated plate, printed wiring board, and semiconductor package1 Oct 2026US 2026/0297317 A1Resonac Corporation
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package24 Sep 2026US 2026/0286077 A1Resonac Corporation
- Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board16 Jul 2026US 2026/0201158 A1Panasonic Intellectual Property Management Co., Ltd.
- Polymer compositions and products formed therewith12 Mar 2026US 2026/0071057 A1Church & Dwight Co., Inc.
- Rubber filler, rubber composite comprising the same, and preparation method therefor and use thereof8 Jan 2026US 2026/0008891 A1PetroChina Company Limited
Most cited
By later US patents
- Nano-structured polymer composites and process for preparing same32US 8,420,704 B2Regents of the University of Minnesota · 2013
- Polyolefin interpenetrated network material for hydrocarbon recovery18US 9,861,954 B2The Penn State Research Foundation · 2018
- Modification of liquid hydrocarbons9US 4,292,045 AImperial Chemical Industries PLC · 1981
- Modification of liquid hydrocarbons9US 4,334,891 AImperial Chemical Industries PLC · 1982
- Method for preparing decomposable film and its utilization6US 5,376,406 AMitsui Toatsu Chemicals, Inc. · 1994