C08G 59/72
Complexes of boron halides
C08G59/72 (Complexes of boron halides) appears on 69 US grants and 51 published applications in this corpus.
Search patents in C08G- Granted patents
- 69
- Published applications
- 51
- Assignees
- 63
- Inventors
- 208
- Latest grant
- 30 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 0 |
| 2003 | 2 | 4 |
| 2004 | 1 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 2 | 3 |
| 2014 | 1 | 2 |
| 2015 | 0 | 3 |
| 2016 | 4 | 4 |
| 2017 | 0 | 5 |
| 2018 | 4 | 3 |
| 2019 | 4 | 3 |
| 2020 | 1 | 3 |
| 2021 | 1 | 8 |
| 2022 | 3 | 4 |
| 2023 | 2 | 2 |
| 2024 | 2 | 1 |
| 2025 | 4 | 0 |
| 2026 | 0 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition30 Sep 2025US 12,428,553 B2Segi Enc Co., Ltd.
- Accelerator composition for the cure of epoxy resins with aromatic amines20 May 2025US 12,304,994 B2Huntsman Advanced Materials Licensing (Switzerland) GmbH
- Insulating varnish composition, rotating machine coil and rotating machine6 May 2025US 12,291,616 B2Mitsubishi Electric Corporation
- Epoxy resin composition, intermediate substrate, and fiber-reinforced composite material4 Mar 2025US 12,240,975 B2Toray Industries, Inc.
- Sheet-form insulating varnish and producing method therefor, electrical device, and rotary electric machine23 Jul 2024US 12,043,734 B2Mitsubishi Electric Corporation
- Epoxy-alcohol-based multi-component resin system19 Feb 2026US 2026/0049173 A1Hilti Aktiengesellschaft
- Thermosetting resin composition, cured product of same, prepreg, fiber-reinforced composite material, and high-pressure gas container5 Feb 2026US 2026/0035557 A1Mitsubishi Gas Chemical Company, Inc.
- Uv-curable composition and use thereof22 Jan 2026US 2026/0022202 A1Dow Silicones Corporation
- Direct write dual cure gasket4 Jan 2024US 2024/0002692 A1Raytheon Company
- Photocationically curable composition and dental curable composition12 Oct 2023US 2023/0320940 A1Tokuyama Dental Corporation
Most cited
By later US patents
- Non-nucleophilic acid salts of amines as cure accelerators35US 4,775,734 AAshland Oil, Inc. · 1988
- Onium borates/borates of organometallic complexes and cationic initiation of polymerization therewith29US 5,468,902 ARhone-Poulenc Chimie · 1995
- Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst25US 6,617,401 B2General Electric Company · 2003
- Process for forming an epoxy-acrylate coating24US 4,444,806 AW. R. Grace & Co. · 1984
- Amine-borane adduct curing agents for epoxy/anhydride resins23US 5,034,464 AE. I. Du Pont de Nemours and Company · 1991