C08G 59/54
Amino amides>
C08G59/54 (Amino amides>) appears on 145 US grants and 128 published applications in this corpus.
Search patents in C08G- Granted patents
- 145
- Published applications
- 128
- Assignees
- 116
- Inventors
- 403
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 5 | 0 |
| 1985 | 9 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 7 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 2 |
| 2003 | 0 | 2 |
| 2004 | 1 | 2 |
| 2005 | 1 | 3 |
| 2006 | 0 | 1 |
| 2007 | 3 | 4 |
| 2008 | 1 | 5 |
| 2009 | 2 | 5 |
| 2010 | 1 | 4 |
| 2011 | 3 | 8 |
| 2012 | 2 | 5 |
| 2013 | 5 | 6 |
| 2014 | 3 | 5 |
| 2015 | 2 | 4 |
| 2016 | 7 | 6 |
| 2017 | 4 | 4 |
| 2018 | 3 | 5 |
| 2019 | 5 | 5 |
| 2020 | 5 | 8 |
| 2021 | 2 | 8 |
| 2022 | 5 | 8 |
| 2023 | 5 | 7 |
| 2024 | 2 | 8 |
| 2025 | 4 | 5 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low density flame retardant two-component composition for structural void filling15 Sep 2026US 12,735,527 B2Zephyros, Inc.
- Two-part epoxy-based structural adhesive composition16 Jun 2026US 12,655,332 B2Henkel AG & Co. KGaA
- Epoxy composition comprising a bio-based epoxy compound31 Mar 2026US 12,590,207 B2Henkel AG & Co. KGaA
- Epoxy resin composition for use as structural adhesive30 Dec 2025US 12,509,561 B2BASF SE
- Toughened two-component epoxy composition29 Apr 2025US 12,286,530 B2Sika Technology AG
- Fire retardant coatings10 Sep 2026US 2026/0265540 A1PPG Industries Ohio, Inc.
- Method for producing a curing agent for a waterborne epoxy coating formulation3 Sep 2026US 2026/0258273 A1Specialty Operations France
- Electrically conductive resin composition and cured product thereof9 Jul 2026US 2026/0193407 A1Threebond Co., Ltd.
- Coating compositions18 Jun 2026US 2026/0167767 A1PPG Industries Ohio, Inc.
- Two-component epoxy adhesive for liquified natural gas containers7 May 2026US 2026/0125584 A1Sika Technology AG
Most cited
By later US patents
- Low temperature curing coating composition47US 4,503,174 AE. I. Du Pont de Nemours and Company · 1985
- Semiconductor device and method of making28US 5,919,713 AFujitsu Limited · 1999
- Liquid, solventless, complex polymeric compositions, thermosetting at ambient temperatures through addition polymerization mechanisms27US 4,742,147 A1988
- Solventless polymeric composition reaction product of (1) adduct of amine and acrylate with (2) polyacrylate25US 4,675,374 A1987
- Solventless polymeric composition comprising non arylamine, polyacrylate and epoxide24US 4,547,562 A1985