C08G 59/28
Containing acyclic nitrogen atoms
Official title: containing acyclic nitrogen atoms
C08G59/28 (Containing acyclic nitrogen atoms) appears on 176 US grants and 143 published applications in this corpus.
Search patents in C08G- Granted patents
- 176
- Published applications
- 143
- Assignees
- 122
- Inventors
- 508
- Latest grant
- 3 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 6 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 7 | 0 |
| 1994 | 7 | 0 |
| 1995 | 8 | 0 |
| 1996 | 4 | 0 |
| 1997 | 8 | 0 |
| 1998 | 6 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 4 |
| 2003 | 1 | 1 |
| 2004 | 2 | 2 |
| 2005 | 2 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 2 |
| 2008 | 0 | 2 |
| 2009 | 1 | 2 |
| 2010 | 1 | 1 |
| 2011 | 2 | 5 |
| 2012 | 1 | 3 |
| 2013 | 1 | 3 |
| 2014 | 2 | 4 |
| 2015 | 2 | 4 |
| 2016 | 2 | 4 |
| 2017 | 4 | 4 |
| 2018 | 3 | 6 |
| 2019 | 2 | 11 |
| 2020 | 5 | 18 |
| 2021 | 10 | 18 |
| 2022 | 11 | 15 |
| 2023 | 9 | 8 |
| 2024 | 7 | 10 |
| 2025 | 9 | 6 |
| 2026 | 2 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Thermosetting coating composition and coated article6 Jan 2026US 12,516,215 B2Kansai Paint Co., Ltd.
- Epoxy resin composition, prepreg and fiber-reinforced composite material9 Dec 2025US 12,492,285 B2Toray Industries, Inc.
- Liquid resin composition for compression molding and electronic component apparatus28 Oct 2025US 12,454,612 B2Namics Corporation
- Prepreg, method for producing same, and slit tape prepreg21 Oct 2025US 12,448,510 B2Toray Industries, Inc.
- One component composition based on epoxy resins10 Sep 2026US 2026/0265592 A1Henkel AG & Co. KGaA
- Conductive resin composition27 Aug 2026US 2026/0250457 A1Threebond Co., Ltd.
- Thermosetting resin composition, cured product, and flexible printed board27 Aug 2026US 2026/0250500 A1Resonac Corporation
- Epoxy resin composition for rtm, cured resin product and fiber-reinforced composite material, and manufacturing method therefor30 Jul 2026US 2026/0217903 A1Toray Industries, Inc.
- Thermosetting maleimide resin composition for stress-relief layer for glass-core substrate and printed wiring board including the same30 Jul 2026US 2026/0218021 A1Shin-Etsu Chemical Co., Ltd.
Most cited
By later US patents
- Epoxy-terminated polyoxazolidones and process for the preparation thereof67US 5,112,932 AThe Dow Chemical Company · 1992
- Arylamine containing polyhydroxy ether resins and system utilizing arylamine containing polyhydroxyl ether resins66US 4,818,650 AXerox Corporation · 1989
- Hydroxy-functional poly(amide ethers) as thermoplastic barrier resins51US 5,089,588 AThe Dow Chemical Company · 1992
- Reversibly color-changeable materials42US 5,068,062 ATeijin Limited · 1991
- Arylamine containing polyhydroxyether resins34US 4,956,440 AXerox Corporation · 1990