C08G 59/182
Using pre-adducts of epoxy compounds with curing agents
Official title: {using pre-adducts of epoxy compounds with curing agents}
C08G59/182 (Using pre-adducts of epoxy compounds with curing agents) appears on 556 US grants and 481 published applications in this corpus.
Search patents in C08G- Granted patents
- 556
- Published applications
- 481
- Assignees
- 257
- Inventors
- 1,328
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 2 | 0 |
| 1978 | 10 | 0 |
| 1979 | 5 | 0 |
| 1980 | 6 | 0 |
| 1981 | 10 | 0 |
| 1982 | 10 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 12 | 0 |
| 1986 | 7 | 0 |
| 1987 | 5 | 0 |
| 1988 | 8 | 0 |
| 1989 | 6 | 0 |
| 1990 | 6 | 0 |
| 1991 | 13 | 0 |
| 1992 | 7 | 0 |
| 1993 | 14 | 0 |
| 1994 | 11 | 0 |
| 1995 | 11 | 0 |
| 1996 | 17 | 0 |
| 1997 | 14 | 0 |
| 1998 | 18 | 0 |
| 1999 | 6 | 0 |
| 2000 | 15 | 0 |
| 2001 | 11 | 0 |
| 2002 | 13 | 8 |
| 2003 | 8 | 7 |
| 2004 | 8 | 18 |
| 2005 | 4 | 8 |
| 2006 | 4 | 5 |
| 2007 | 2 | 22 |
| 2008 | 6 | 17 |
| 2009 | 7 | 30 |
| 2010 | 9 | 37 |
| 2011 | 20 | 24 |
| 2012 | 28 | 23 |
| 2013 | 14 | 26 |
| 2014 | 14 | 22 |
| 2015 | 18 | 25 |
| 2016 | 30 | 25 |
| 2017 | 18 | 21 |
| 2018 | 16 | 10 |
| 2019 | 16 | 11 |
| 2020 | 8 | 18 |
| 2021 | 13 | 17 |
| 2022 | 8 | 27 |
| 2023 | 14 | 24 |
| 2024 | 13 | 17 |
| 2025 | 14 | 21 |
| 2026 | 12 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Epoxy resin curing agent, epoxy resin composition, and paint6 Oct 2026US 12,753,270 B2Mitsubishi Gas Chemical Company, Inc.
- Epoxy curing agents and uses thereof25 Aug 2026US 12,715,957 B2Evonik Operations GmbH
- Epoxy-amine adduct21 Jul 2026US 12,686,739 B2Evonik Operations GmbH
- Structural bonding adhesive21 Jul 2026US 12,686,740 B2Zephyros, Inc.
- Textile fabrics with reduced buildup of odor7 Jul 2026US 12,674,275 B2Archroma International (Germany) GmbH
- Uv resistant surfacing materials for composite parts24 Sep 2026US 2026/0286168 A1Cytec Industries Inc.
- Epoxy resin composition, encapsulant, semiconductor encapsulant, adhesive, camera module, semiconductor package, and electronic equipment17 Sep 2026US 2026/0275174 A1Asahi Kasei Kabushiki Kaisha
- Method for producing a curing agent for a waterborne epoxy coating formulation3 Sep 2026US 2026/0258273 A1Specialty Operations France
- Phosphonate epoxy thermosets27 Aug 2026US 2026/0250458 A1
- Curable compound, curable resin composition, cured product, and laminate13 Aug 2026US 2026/0234319 A1DIC Corporation
Most cited
By later US patents
- Heat-curable, thermally expandable moulded park127US 6,573,309 B1Henkel-Teroson GmbH · 2003
- Hardenable resin compositions and methods88US 5,232,961 A1993
- Coating method using aqueous glycidyl compound-amine hardner-thermoplastic resin compositions84US 4,966,945 ASchering Corporation · 1990
- Aqueous dispersion of epoxy resin and blend of epoxy resin-polyoxyalkylene amines78US 6,077,884 ASika Chemie GmbH · 2000
- Epoxy resin fortifiers based on aromatic amides73US 4,480,082 ACanadian Patents and Development Limited · 1984