C08G 16/04
Chemically modified polycondensates
C08G16/04 (Chemically modified polycondensates) appears on 39 US grants and 18 published applications in this corpus.
Search patents in C08G- Granted patents
- 39
- Published applications
- 18
- Assignees
- 22
- Inventors
- 69
- Latest grant
- 18 Feb 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 6 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 1 | 1 |
| 2012 | 0 | 1 |
| 2013 | 2 | 2 |
| 2014 | 3 | 3 |
| 2015 | 2 | 2 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 0 | 2 |
| 2019 | 2 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low-temperature curable compositions18 Feb 2020US 10,563,040 B2Eastman Chemical Company
- Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same10 Sep 2019US 10,407,598 B2Jsr Corporation
- Diazo-resin, photoresist composition and method of preparing same28 May 2019US 10,303,053 B2Boe Technology Group Co., Ltd.
- Aminoplast crosslinker resin compositions, process for their preparation, and method of use24 Oct 2017US 9,796,805 B2Allnex Austria GmbH
- Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film22 Dec 2015US 9,217,053 B2DIC Corporation
- Ion conductive polymer and separator including the same1 Jan 2026US 2026/0001981 A1SK Innovation Co., Ltd.
- Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board29 Jul 2021US 2021/0229407 A1Mitsubishi Gas Chemical Company, Inc.
- Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same14 Feb 2019US 2019/0048236 A1Jsr Corporation
- Low-temperature curable compositions13 Dec 2018US 2018/0355145 A1Eastman Chemical Company
- Alkoxylated resol-type phenol resin manufacturing method, alkoxylated resol-type phenol resin, resin composition, and coating19 Apr 2018US 2018/0105632 A1DIC Corporation
Most cited
By later US patents
- Terminal-modified difunctional sulfur-containing polymers, compositions thereof and methods of use40US 8,541,513 B2PRC-DeSoto International, Inc. · 2013
- Photopolymer cleavage imaging system39US 4,435,496 AAmerican Hoechst Corporation · 1984
- High temperature polymers from methoxy functional ether aromatic monomers31US 4,110,279 AThe Dow Chemical Company · 1978
- Use of salts of water-soluble27US 4,725,665 AChemie Linz Aktiengesellschaft · 1988
- Biodegradable polyketal polymers and methods for their formation and use27US 8,383,758 B2The General Hospital Corporation · 2013