Diazo-resin, photoresist composition and method of preparing same

Abstract

Diazo-resin-containing photoresist compositions and methods of preparing the same are provided for solving the problem that existing diazo-resins cannot be applied in LCD photoresists because the storage periods of the diazo-resins themselves and the printed boards made thereby are both short due to poor thermal stability of the diazo-resins. The diazo-resins of the present invention have excellent thermal stability and exhibit strong resistance to dry etching when being used in negative photoresists, while high resolution can be achieved. Meanwhile, during exposure, portions of the diazo-resins can crosslink with hydrogen bonds on surface of SiO or SiON film forming a barrier layer or passivation layer, such that the adhesion between the photoresists and the film layer is increased, and the photoresists would not peel during development. Thus, the utilization of tackifiers for enhancing the adhesion between a photoresist and surface of SiO or SiON film before masking can be omitted.

Dependencies are inferred from the claim text.