Back to results
US 2021/0229407 A1Published application
Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsKazuyuki Higashita, Katsuya Yamamoto, Saori Honda, Yoshitaka Ueno
Life of this patent
Estimating the term…
Abstract
Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).
Claims14
1:
- A resin composition containing a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).
2:
- The resin composition according to claim 1, wherein the styrene-based elastomer (A) is at least one selected from the group consisting of a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-hydrogenated butadiene-styrene block copolymer, a styrene-hydrogenated isoprene-styrene block copolymer, and a styrene-hydrogenated (isoprene/butadiene)-styrene block copolymer.
3:
- The resin composition according to claim 1, wherein a content of the styrene-based elastomer (A) is from 1 to 30 parts by mass relative to 100 parts by mass of resin solid component.
4:
- The resin composition according to claim 1, wherein a content of the styrene oligomer (B) is from 1 to 30 parts by mass relative to 100 parts by mass of resin solid component.
5:
- The resin composition according to claim 1, further containing a polyphenylene ether (E).
6:
- The resin composition according to claim 5, wherein the polyphenylene ether (E) is represented by Formula (1) and has a number average molecular weight of not lower than 1000 and not higher than 7000 and a minimum melt viscosity of not higher than 50000 Pa·s:
- in Formula (1), X represents an aryl group;
- —(Y—O)m— represents a polyphenylene ether moiety;
- R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group;
- m represents an integer of from 1 to 100;
- n represents an integer of from 1 to 6;
- and q represents an integer of from 1 to 4.
4 more elements
7:
- The resin composition according to claim 5, wherein the polyphenylene ether compound (E) is represented by Formula (11):
- in Formula (11), X is an aromatic group selected from groups represented by Formula (12), Formula (13), and Formula (14);
- each —(Y—O)m— represents a polyphenylene ether moiety;
- and each m represents an integer of from 1 to 100;
- in Formula (13), R28, R29, R30, and R3 each independently represent a hydrogen atom or a methyl group;
- and —B— is a linear, branched, or cyclic divalent hydrocarbon group having 20 or less carbon atoms;
- and
- in Formula (14), —B— is a linear, branched, or cyclic divalent hydrocarbon group having 20 or less carbon atoms.
5 more elements
8:
- The resin composition according to claim 1, further containing an inorganic filler (F).
9:
- The resin composition according to claim 8, wherein a content of the inorganic filler (F) is from 50 to 1600 parts by mass relative to 100 parts by mass of resin solid component.
10:
- A prepreg comprising:
- a substrate, and
- a layer formed from a resin composition described in claim 1.
11:
- A metal foil-clad laminate comprising:
- one or more laminated prepregs described in claim 10, and
- a metal foil disposed on one side or both sides of the laminated prepregs.
12:
- A resin sheet comprising a layer formed from a resin composition described in claim 1.
13:
- A resin sheet comprising:
- a support, and
- a layer disposed on the support, the layer being formed from a resin composition described in claim 1.
14:
- A printed wiring board comprising an insulating layer and a conducting layer disposed on a surface of the insulating layer, wherein
- the insulating layer comprises a layer formed from a resin composition described in claim 1.