C04B 2237/095
The active component for bonding being silicon
C04B2237/095 (The active component for bonding being silicon) appears on 10 US grants and 6 published applications in this corpus.
Search patents in C04B- Granted patents
- 10
- Published applications
- 6
- Assignees
- 10
- Inventors
- 26
- Latest grant
- 21 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 2 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 2 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 2 |
| 2024 | 1 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Copper-ceramic bonded body, insulated circuit board, method for producing copper-ceramic bonded body, and method for producing insulated circuit board21 Oct 2025US 12,451,404 B2Mitsubishi Materials Corporation
- Methods for joining ceramic components to form unitary ceramic components30 Jan 2024US 11,884,597 B2General Electric Company
- Method for assembling parts made of SiC materials by means of non-reactive brazing in an oxidizing atmosphere, brazing compositions, and gasket and assembly obtained by said method3 Oct 2017US 9,776,929 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Layered deposition for reactive joining of composites21 Feb 2017US 9,573,354 B2ROLLS-ROYCE plc
- Sealing composition for sealing aluminum nitride and aluminum oxynitride ceramics22 Jun 2010US 7,741,237 B1Osram Sylvania Inc.
- Methods for joining ceramic components to form unitary ceramic components28 Dec 2023US 2023/0416163 A1General Electric Company
- Copper-ceramic bonded body, insulated circuit board, method for producing copper-ceramic bonded body, and method for producing insulated circuit board2 Feb 2023US 2023/0034784 A1Mitsubishi Materials Corporation
- Ceramic joined body and flow passage body7 Jan 2016US 2016/0001526 A1KYOCERA Corporation
- Method for assembling parts made of sic materials by means of non-reactive brazing in an oxidizing atmosphere, brazing compositions, and gasket and assembly obtained by said method6 Nov 2014US 2014/0328615 A1Commissariat A L'energie Atomique Et Aux Energies Al Ternatives
- Layered deposition for reactive joining of composites18 Sep 2014US 2014/0272431 A1ROLLS-ROYCE plc
Most cited
By later US patents
- Brazable layer for indexable cutting insert37US 4,460,382 AGeneral Electric Company · 1984
- Method of brazing carbide using copper-zinc-manganese-nickel alloys29US 4,684,052 AHandy & Harman · 1987
- Process for producing sandwich structures from fiber-reinforced ceramics24US 5,632,834 ADornier GmbH · 1997
- Ceramic sheath device with multilayer silicon nitride filler insulation15US 5,811,761 AIsuzu Ceramics Research Institute Co., Ltd. · 1998
- Sealing composition for sealing aluminum nitride and aluminum oxynitride ceramics3US 7,659,220 B1Osram Sylvania Inc. · 2010