C04B 2235/787
Oriented grains
C04B2235/787 (Oriented grains) appears on 241 US grants and 312 published applications in this corpus.
Search patents in C04B- Granted patents
- 241
- Published applications
- 312
- Assignees
- 135
- Inventors
- 605
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 10 |
| 2003 | 2 | 8 |
| 2004 | 5 | 8 |
| 2005 | 0 | 8 |
| 2006 | 6 | 14 |
| 2007 | 4 | 14 |
| 2008 | 6 | 14 |
| 2009 | 9 | 22 |
| 2010 | 12 | 16 |
| 2011 | 13 | 17 |
| 2012 | 10 | 18 |
| 2013 | 20 | 19 |
| 2014 | 13 | 19 |
| 2015 | 20 | 13 |
| 2016 | 14 | 13 |
| 2017 | 9 | 18 |
| 2018 | 17 | 16 |
| 2019 | 17 | 16 |
| 2020 | 9 | 9 |
| 2021 | 12 | 12 |
| 2022 | 9 | 6 |
| 2023 | 7 | 11 |
| 2024 | 5 | 7 |
| 2025 | 6 | 2 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Annealing separator composition for grain- oriented electrical steel sheet, grain-oriented electrical steel sheet, and method for producing grain-oriented electrical steel sheet6 Oct 2026US 12,753,457 B2Posco
- Ceramic article, semiconductor apparatus for manufacturing a semiconductor structure and method of manufacturing a ceramic article25 Aug 2026US 12,715,816 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Liquid absorbing body21 Apr 2026US 12,605,692 B2Mitsubishi Pencil Company, Limited
- Silicon nitride sintered substrate6 Jan 2026US 12,515,953 B2Tokuyama Corporation
- Aluminum nitride plate16 Sep 2025US 12,415,728 B2NGK Insulators, Ltd.
- Inorganic structure and method for manufacturing inorganic structure26 Mar 2026US 2026/0085448 A1Osaka University
- Support substrate, composite substrate, electronic device, and module5 Feb 2026US 2026/0039273 A1Quanzhou Sanan Integrated Circuit Co., Ltd.
- Method and system for obtaining high-quality cubic silicon carbide9 Oct 2025US 2025/0313991 A1LPE S. pA
- Piezoelectric material composition, method of manufacturing the same,piezoelectric device, and apparatus including the piezoelectric device6 Mar 2025US 2025/0081854 A1Korea University Research and Business Foundation
- Thermoformable Boron-Based Ceramic Material and Use in Thermal Management5 Dec 2024US 2024/0399620 A1Northeastern University
Most cited
By later US patents
- Thin film lithium conducting powder material deposition from flux47US 9,362,546 B1QuantumScape Corporation · 2016
- Thin piezoelectric film element, process for the preparation thereof and ink jet recording head using thin piezoelectric film element42US 6,097,133 ASeiko Epson Corporation · 2000
- Zirconia sintered body, process for production thereof, and application thereof39US 6,087,285 ATosoh Corporation · 2000
- Processes and apparatuses for preparing permanent magnet stators34US 4,250,128 AMagna Motors Corporation · 1981
- Thin piezoelectric film element, process for the preparation thereof and ink jet recording head using thin piezoelectric film element34US 6,294,860 B1Seiko Epson Corporation · 2001