B41F 16/0066
Printing dies or forms
Official title: {Printing dies or forms}
B41F16/0066 (Printing dies or forms) appears on 14 US grants and 22 published applications in this corpus.
Search patents in B41F- Granted patents
- 14
- Published applications
- 22
- Assignees
- 18
- Inventors
- 40
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 2 | 0 |
| 2018 | 0 | 2 |
| 2019 | 0 | 1 |
| 2020 | 2 | 2 |
| 2021 | 2 | 2 |
| 2022 | 0 | 0 |
| 2023 | 0 | 4 |
| 2024 | 1 | 5 |
| 2025 | 5 | 2 |
| 2026 | 1 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for applying a positive pressure within a dye sublimation machine7 Apr 2026US 12,594,780 B2Sekisui Kydex, LLC
- Systems and methods for film positive print transfers21 Oct 2025US 12,447,735 B2
- Punching die for punching machine12 Aug 2025US 12,384,143 B2Illinois Tool Works Inc.
- Source wafer, method, and optoelectronic devices25 Feb 2025US 12,233,639 B2Rockley Photonics Limited
- Systems and methods of pyrometric temperature measurement and control in dye sublimation28 Jan 2025US 12,208,639 B2Sekisul Kydex, LLC
- Flexible heating plate for thermal transfer2 Jul 2026US 2026/0184062 A1Yiwushi Taile Mechanical Equipment Co., Ltd.
- Heating tool and heat-pressing machine5 Mar 2026US 2026/0061718 A1Silhouette Japan Corporation
- Multi-station dye sublimation apparatus for pre-heating and for facilitating simultaneous sublimation cycles1 May 2025US 2025/0135789 A1Sekisui Kydex, LLC
- Heating drum for thermal transfer and method for manufacturing the same17 Apr 2025US 2025/0121594 A1Kyungil-Tech Co., Ltd.
- Thermal transfer printing device10 Oct 2024US 2024/0336057 A1Hunan Sijiu Technology Co., Ltd
Most cited
By later US patents