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US 12,233,639 B2Granted
Source wafer, method, and optoelectronic devices
AssigneeRockley Photonics Limited
InventorsHua Yang, Mohamad Dernaika, Frank Peters, Guomin Yu
Life of this patent
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Abstract
A source wafer for use in a micro-transfer printing process. The source wafer comprising: a wafer substrate; a photonic component, provided in a device coupon, the device coupon being attached to the wafer substrate via a release layer; and one or more etch stop layers, located between the photonic component and the wafer substrate.
Claims17
A source wafer, for use in a micro-transfer printing process, the source wafer comprising:
- a wafer substrate;
- a photonic component, provided in a device coupon, the device coupon being attached to the wafer substrate via a release layer;
- and
- one or more etch stop layers, located between the photonic component and the wafer substrate,
- wherein a first etch stop layer of the one or more etch stop layers is located between the photonic component and the release layer, and
- wherein the source wafer further comprises an intermediate semiconductor layer, located between the etch stop layer and the release layer.
3 more elements
A source wafer, for use in a micro-transfer printing process, the source wafer comprising:
- a wafer substrate;
- a photonic component, provided in a device coupon, the device coupon being attached to the wafer substrate via a release layer;
- and
- one or more etch stop layers, located between the photonic component and the wafer substrate,
- wherein the or each etch stop layer is formed of a plurality of sub-layers, two or more of the sub-layers of the plurality of sub-layers being formed of respectively different materials.
2 more elements
Dependencies are inferred from the claim text.