B29L 2031/3493
Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
Official title: {Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces}
B29L2031/3493 (Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces) appears on 71 US grants and 66 published applications in this corpus.
Search patents in B29L- Granted patents
- 71
- Published applications
- 66
- Assignees
- 81
- Inventors
- 240
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 0 |
| 2002 | 4 | 4 |
| 2003 | 3 | 1 |
| 2004 | 4 | 4 |
| 2005 | 3 | 3 |
| 2006 | 2 | 0 |
| 2007 | 2 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 2 | 2 |
| 2011 | 1 | 2 |
| 2012 | 1 | 1 |
| 2013 | 1 | 3 |
| 2014 | 0 | 0 |
| 2015 | 2 | 6 |
| 2016 | 2 | 3 |
| 2017 | 3 | 6 |
| 2018 | 5 | 3 |
| 2019 | 3 | 4 |
| 2020 | 4 | 2 |
| 2021 | 2 | 5 |
| 2022 | 1 | 3 |
| 2023 | 2 | 6 |
| 2024 | 5 | 2 |
| 2025 | 2 | 4 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and device for producing a plastics component, and a plastics component24 Feb 2026US 12,558,869 B2Leonhard Kurz Stiftung & Co. KG
- Preform layered body and layered container8 Jul 2025US 12,350,875 B2Nissha Co., Ltd.
- Electrical connectors with thin interior walls15 Apr 2025US 12,278,454 B2Yazaki Corporation
- Heating shell for three-way connector26 Nov 2024US 12,152,716 B2Hutchinson
- Symbol button for vehicle and manufacturing method thereof19 Nov 2024US 12,145,298 B2Hyundai Motor Company
- Method for preparing micro-nano flexible conductive circuit based on ultrasonic driving of liquid metal4 Dec 2025US 2025/0374438 A1Harbin Inst. of Tech (Shenzhen) (Inst. of Science and Tech Innovation, Harbin Inst. of Tech)
- Lens heating device for a vehicle lamp7 Aug 2025US 2025/0254759 A1Min Hsiang Corporation
- Electrical connectors with thin interior walls19 Jun 2025US 2025/0202183 A1Yazaki Corporation
- Overmolded busbars and integrated sensors2 Jan 2025US 2025/0007110 A1Atieva, Inc.
- Method and tool for producing a connection between at least two metal parts15 Aug 2024US 2024/0269907 A1Lisa Dräxlmaier GmbH
Most cited
By later US patents
- Method for manufacturing printed circuit boards96US 4,943,346 ASiemens Aktiengesellschaft · 1990
- Methods and apparatuses for an integrated wireless device56US 7,181,172 B2Centurion Wireless Technologies, Inc. · 2007
- Multi-shot molded touch switch40US 6,960,735 B2Lear Corporation · 2005
- Low-flammability polyamide molding materials29US 5,773,556 ATicona LLC · 1998
- Polymer stud grid array29US 5,929,516 AInteruniversitair Micro-Electronica-Centrum VZW · 1999