Polymer stud grid array

A polymer stud grid array comprising:

• an injection molded, three-dimensional substrate composed of an electrically insulating polymer;
• the substrate comprising an underside with a plurality of polymer studs integrally formed on the underside of the substrate during the injection molding thereof;
• the polymer studs each comprising a solderable end surface, each solderable end surface being coated with an outside terminal;
• each outside terminal being connected to at least one of a plurality of interconnections, each interconnection being disposed on the underside of the substrate, each interconnection connecting one of the outside terminals to one of a plurality of inside terminals;
• at least one chip arranged on the substrate, the chip comprising terminals that are electrically conductively connected to the inside terminals wherein the polymer studs planarly arranged in the grid array on the underside of the substrate,
• the substrate further comprising a trough with the chip being arranged in the trough of the substrate,
• the chip being arranged in a face-down position in the trough and further wherein the terminals of the chip are electrically conductively connected by flip-chip contacting to the inside terminals arranged at the floor of the trough.