B29C 64/336
Of two or more materials
Official title: of two or more materials
B29C64/336 (Of two or more materials) appears on 448 US grants and 802 published applications in this corpus.
Search patents in B29C- Granted patents
- 448
- Published applications
- 802
- Assignees
- 364
- Inventors
- 1,435
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 2 |
| 2011 | 1 | 2 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 5 |
| 2015 | 1 | 12 |
| 2016 | 2 | 4 |
| 2017 | 8 | 38 |
| 2018 | 6 | 78 |
| 2019 | 22 | 70 |
| 2020 | 53 | 78 |
| 2021 | 61 | 82 |
| 2022 | 49 | 109 |
| 2023 | 65 | 78 |
| 2024 | 64 | 96 |
| 2025 | 65 | 72 |
| 2026 | 47 | 73 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Liquid and powder material handling systems within additive manufacturing and methods for their use6 Oct 2026US 12,752,489 B2General Electric Company
- System and method for additive manufacturing of an object with foam infill material29 Sep 2026US 12,746,719 B2Accenture Global Solutions Limited
- AI enabled 3D printing for controlled microstructure through insulation integration29 Sep 2026US 12,746,727 B2International Business Machines Corporation
- Series enabled multi-material extrusion technology29 Sep 2026US 12,747,129 B2Mosaic Manufacturing Ltd.
- Interfacial and support structures for inorganic material printing and methods thereof22 Sep 2026US 12,741,419 B2Xerox Corporation
- Three-dimensional shaping apparatus8 Oct 2026US 2026/0307334 A1Seiko Epson Corporation
- Manufacturing method and manufacturing apparatus for powder compact24 Sep 2026US 2026/0284744 A1Toyo Seiko Co., Ltd.
- Three-dimensional shaping apparatus17 Sep 2026US 2026/0273843 A1Seiko Epson Corporation
- Three-dimensional shaping apparatus17 Sep 2026US 2026/0273855 A1Seiko Epson Corporation
- System and method for high throughput three-dimensional printing17 Sep 2026US 2026/0273856 A1Stratasys, Inc.
Most cited
By later US patents
- Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor270US 5,398,193 A1995
- Powder distribution in additive manufacturing135US 9,126,167 B2Arcam AB · 2015
- Fiber-reinforced 3D printing117US 10,406,750 B2The Regents of the University of Michigan · 2019
- Precision pharmaceutical 3D printing device32US 10,201,503 B1Triastek, Inc. · 2019
- Automated systems for composite part fabrication30US 9,796,140 B2Autodesk, Inc. · 2017