Three-dimensional shaping apparatus
AssigneeSeiko Epson Corporation
InventorEiji OKAMOTO
Life of this patent
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Abstract
A three-dimensional shaping apparatus is configured including: a plasticizing unit configured to plasticize at least a part of a shaping material containing a thermoplastic resin to generate a plasticized material; a fiber material supply unit configured to supply a fiber material; a nozzle configured to discharge the plasticized material toward a stage; and an ultrasonic wave applying unit configured to apply ultrasonic waves to at least one of the plasticized material and the fiber material. The ultrasonic wave applying unit comes into contact with the plasticized material discharged toward the stage.
Claims7
A three-dimensional shaping apparatus comprising:
- a plasticizing unit configured to plasticize at least a part of a shaping material containing a thermoplastic resin to generate a plasticized material;
- a fiber material supply unit configured to supply a fiber material;
- a nozzle configured to discharge the plasticized material toward a stage;
- and
- an ultrasonic wave applying unit configured to apply ultrasonic waves to at least one of the plasticized material and the fiber material, wherein
- the ultrasonic wave applying unit comes into contact with the plasticized material discharged toward the stage.
Dependencies are inferred from the claim text.