Three-dimensional shaping apparatus
AssigneeSeiko Epson Corporation
InventorEiji OKAMOTO
Life of this patent
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Abstract
A three-dimensional shaping apparatus is configured including: a plasticizing unit configured to plasticize at least a part of a shaping material containing a thermoplastic resin to generate a plasticized material; a fiber material supply unit configured to supply a fiber material; a nozzle configured to discharge the plasticized material and the fiber material toward a stage; and an ultrasonic wave applying unit configured to apply ultrasonic waves to at least one of the plasticized material and the fiber material, in which a distance between the nozzle and the stage is larger than a distance between the ultrasonic wave applying unit and the stage.
Claims8
A three-dimensional shaping apparatus comprising:
- a plasticizing unit configured to plasticize at least a part of a shaping material containing a thermoplastic resin to generate a plasticized material;
- a fiber material supply unit configured to supply a fiber material;
- a nozzle configured to discharge the plasticized material and the fiber material toward a stage;
- and
- an ultrasonic wave applying unit configured to apply ultrasonic waves to at least one of the plasticized material and the fiber material, wherein
- a distance between the nozzle and the stage is larger than a distance between the ultrasonic wave applying unit and the stage.
Dependencies are inferred from the claim text.