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  1. Technology classes
  2. /B · Performing operations
  3. /B29 · Working of plastics
  4. /B29C · Shaping or joining of plastics
  5. /B29C 2945/00 · Indexing scheme relating to injection moulding, i.e. forcing the required volume of
  6. /B29C 2945/76 · Measuring, controlling or regulating
  7. /B29C 2945/76344 · Phase or stage of measurement
  8. /B29C 2945/76351 · Feeding
  9. /B29C 2945/76357
B29C 2945/76357

Inserts

Official title: inserts

B29C2945/76357 (Inserts) appears on 7 US grants and 10 published applications in this corpus.

Search patents in B29C

Where it sits

  1. BPerforming operations
  2. B29Working of plastics
  3. B29CShaping or joining of plastics
  4. B29C 2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of
  5. B29C 2945/76Measuring, controlling or regulating
  6. B29C 2945/76344Phase or stage of measurement
  7. B29C 2945/76351Feeding
  8. B29C 2945/76357Inserts
Granted patents
7
Published applications
10
Assignees
9
Inventors
24
Latest grant
28 May 2024

Filings by year

Granted patentsPublished applications
B29C 2945/76357: granted patents and published applications per publication year
YearGranted patentsPublished applications
200801
200900
201010
201100
201200
201300
201400
201500
201602
201700
201820
201901
202002
202110
202211
202302
202421

200820182024

By publication year.

Recent patents

  • Injection molding apparatus28 May 2024US 11,992,988 B2Seiko Epson Corporation
  • Holding member, work molding system, and work molding method30 Jan 2024US 11,883,990 B2Dai Nippon Printing Co.Ltd.
  • Method for arranging semi-finished products30 Aug 2022US 11,426,899 B2Engel Austria GmbH
  • Method and apparatus for decorative molding18 May 2021US 11,007,696 B2Panasonic Intellectual Property Management Co., Ltd.
  • Injection molding system15 May 2018US 9,969,109 B2Fanuc Corporation
  • Holding member, work molding system, and work molding method11 Apr 2024US 2024/0116227 A1Dai Nippon Printing Co.Ltd.
  • Device and method for injection molding18 May 2023US 2023/0150180 A1EV Group E. Thallner GmbH
  • Control device and control method for injection molding machine27 Apr 2023US 2023/0132160 A1Fanuc Corporation
  • Injection Molding Apparatus24 Nov 2022US 2022/0371248 A1Seiko Epson Corporation
  • Method for arranging semifinished products30 Jul 2020US 2020/0238575 A1Engel Austria GmbH

Most cited

By later US patents
  • Apparatus and method for fabricating semiconductor packages1US 7,824,585 B2Samsung Electronics Co., Ltd. · 2010

Top assignees

Documents
  • Dai Nippon Printing Co.Ltd.3
  • Fanuc Corporation3
  • Engel Austria GmbH2
  • HHekuma GmbH2
  • PIPanasonic Intellectual Property Management Co., Ltd.2
  • Seiko Epson Corporation2
  • EGEV Group E. Thallner GmbH1
  • Samsung Electronics Co., Ltd.1
  • SESamsung Electronics Co., Ltd.1

Often classified with

  • B01LChemical or physical laboratory apparatus for general use2
  • B25JManipulators2
  • B44CProducing decorative effects2
  • B65GTransport or storage devices2
  • G01NInvestigating or analysing materials by determining their chemical or physical properties2
  • G05BControl or regulating systems in general2
  • H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by2
  • B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding1
  • B29LIndexing scheme associated with subclass b29c, relating to particular articles1

Documents that also carry the other class.

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