Apparatus and method for fabricating semiconductor packages
AssigneeSamsung Electronics Co., Ltd.
InventorSeung-Jin Cheon
Life of this patent
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Abstract
An apparatus for fabricating semiconductor packages may include a thickness measurer configured to measure the thickness of a printed circuit board (PCB); mold dies, clamped to the top and the bottom of the PCB, through which a molding compound may be injected; and a pressure controller configured to control a clamp pressure of the mold die in response to the thickness of the PCB. The thickness of the PCB may be measured before molding the PCB, and a clamp pressure corresponding to the measured thickness may be decided. Therefore, it is possible to adjust the thickness variation of a PCB in real time, as they are being produced, to decrease the number of bad packages.
Claims17
An apparatus for fabricating semiconductor packages, comprising:
- mold dies clamped to two surfaces of a printed circuit board (PCB), to form a cavity around said PCB;
- a thickness measurer configured to measure the thickness of said PCB;
- and
- a pressure controller configured to control a clamp pressure of said mold dies in response to said thickness measurer, said clamp pressure causing a portion of a molding resin to fluidize and fill said cavity,
- wherein the thickness measurer is configured to scan the PCB to measure the thickness of the PCB during movement of the PCB into the mold dies.
A method for fabricating semiconductor packages, comprising:
- moving a printed circuit board (PCB) into mold dies which are configured to clamp the PCB:
- scanning the PCB by moving the PCB past a thickness measurer into the mold dies, in order to measure a thickness of the PCB;
- calculating a clamp pressure corresponding to the measured thickness;
- and
- clamping mold dies to the PCB using the calculated clamp pressure.
Dependencies are inferred from the claim text.