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B29C 2045/5635

Mould integrated compression drive means

Official title: {Mould integrated compression drive means}

B29C2045/5635 (Mould integrated compression drive means) appears on 28 US grants and 40 published applications in this corpus.

Search patents in B29C

Granted patents: 28
Published applications: 40
Assignees: 24
Inventors: 55
Latest grant: 15 Jul 2025

Filings by year

B29C 2045/5635: granted patents and published applications per publication year
Year	Granted patents	Published applications
1980	1	0
1981	0	0
1982	0	0
1983	0	0
1984	0	0
1985	0	0
1986	1	0
1987	0	0
1988	0	0
1989	0	0
1990	0	0
1991	1	0
1992	0	0
1993	0	0
1994	0	0
1995	0	0
1996	0	0
1997	1	0
1998	0	0
1999	0	0
2000	0	0
2001	1	0
2002	0	0
2003	2	2
2004	1	0
2005	0	1
2006	0	5
2007	0	1
2008	0	9
2009	1	3
2010	5	2
2011	2	1
2012	1	2
2013	2	0
2014	0	1
2015	0	1
2016	1	0
2017	0	1
2018	0	2
2019	0	0
2020	1	2
2021	1	1
2022	1	3
2023	1	1
2024	3	1
2025	1	1

By publication year. Applications have been published since 2001.

Recent patents

Molded semiconductor device and manufacturing method of molded semiconductor device15 Jul 2025US 12,358,194 B2Taiwan Semiconductor Manufacturing Company.Ltd
Field programmable fluidic array10 Sep 2024US 12,083,724 B211886851 Canada Ltd.
Method for producing a diaphragm for a diaphragm valve23 Jul 2024US 12,042,964 B2GEMÜ Gebr. Müller Apparatebau GmbH & Co. Kommanditgesellschaft
Molding apparatus and manufacturing method of molded semiconductor device18 Jun 2024US 12,011,859 B2Taiwan Semiconductor Manufacturing Company.Ltd
Molding apparatus and manufacturing method of molded semiconductor device22 Aug 2023US 11,731,327 B2Taiwan Semiconductor Manufacturing Company.Ltd

Most cited

By later US patents