B29C 2045/388
Locking pins for retaining the sprue
Official title: {Locking pins for retaining the sprue}
B29C2045/388 (Locking pins for retaining the sprue) appears on 9 US grants and 6 published applications in this corpus.
Search patents in B29C- Granted patents
- 9
- Published applications
- 6
- Assignees
- 6
- Inventors
- 23
- Latest grant
- 27 Feb 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 1 | 0 |
| 2012 | 2 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 0 |
| 2022 | 1 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Injection mold capable of planning and cutting gates in inside thereof and planning and cutting method27 Feb 2024US 11,911,942 B2Zhuji Bihan Jinggong Mould Plastic Co., Ltd.
- Parts degating apparatus using laser12 Jul 2022US 11,383,414 B2Syntec Optics
- Molding die and die-exchanging method19 Feb 2019US 10,207,441 B2Denso Corporation
- Method and apparatus for producing battery pack19 Jun 2012US 8,202,457 B2Panasonic Corporation
- Sucker pin bushing29 May 2012US 8,186,994 B2
- Injection Mold Capable of Planing and Cutting Gates in Inside Thereof and Planing and Cutting Method17 Nov 2022US 2022/0362980 A1Zhuji Bihan Jinggong Mould Plastic Co., Ltd.
- Parts degating apparatus using laser31 Dec 2020US 2020/0406519 A1Syntec Optics
- Molding die and die-exchanging method12 Oct 2017US 2017/0291339 A1Denso Corporation
- Injection mold and injection molding method using the same25 Nov 2010US 2010/0295216 A1Samsung Electronics Co., Ltd.
- Method and apparatus for producing battery pack14 Oct 2010US 2010/0258975 A1Panasonic Corporation
Most cited
By later US patents
- Method of resin-sealing semiconductor device10US 5,783,134 ACitizen Watch Co., Ltd. · 1998
- Mold device for an injection molding machine7US 4,285,659 A1981
- Injection molding apparatus having degating and sprue removal means5US 3,947,210 A1976
- Molding die and die-exchanging method1US 10,207,441 B2Denso Corporation · 2019
- Injection mold and injection molding method using the same1US 7,867,430 B2Samsung Electronics Co., Ltd. · 2011