Injection mold and injection molding method using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSu-Dong Shin, Myoung-Jin Kim, Jeong-Hun Heo
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AssigneeSamsung Electronics Co., Ltd.
InventorsSu-Dong Shin, Myoung-Jin Kim, Jeong-Hun Heo
Estimating the term…
Provided is an injection mold which can reduce the amount of resin that is separated from injection-molded parts and then thrown away. The injection mold includes for an embodiment an extension cylinder coupled to an upper clamp plate and having a nozzle at an end thereof; a nozzle positioner disposed under the nozzle, the nozzle positioner having a nozzle insertion groove adapted to receive the nozzle; a gate-lock-pin holder disposed under the extension cylinder and the nozzle positioner, comprising a gate lock pin which has a first end coupled to a gate molded part and a second end coupled to the gate-lock-pin holder, and adapted to separate the gate molded part from an injection-molded part; a gate stripper plate disposed under the gate-lock-pin holder and adapted to separate the gate molded part from the nozzle; and a cavity plate and a core plate disposed under the gate stripper plate and having a cavity which is shaped like the injection-molded part.
An injection mold comprising:
An injection molding method comprising:
Dependencies are inferred from the claim text.