B26F 1/31
By radiation
Official title: by radiation (by laser beam B23K26/00)
B26F1/31 (By radiation) appears on 31 US grants and 22 published applications in this corpus.
Search patents in B26F- Granted patents
- 31
- Published applications
- 22
- Assignees
- 31
- Inventors
- 80
- Latest grant
- 3 May 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 2 | 3 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 1 | 2 |
| 2007 | 0 | 1 |
| 2008 | 2 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 4 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 1 | 2 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 1 |
| 2019 | 0 | 2 |
| 2020 | 1 | 0 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Process of treating a workpiece using a liquid jet guided laser beam3 May 2022US 11,318,560 B2Synova SA
- Glass-free dielectric layers for printed circuit boards20 Apr 2021US 10,982,060 B2International Business Machines Corporation
- Rotatable manifold cutter for use in portioning7 Apr 2020US 10,611,046 B2John Bean Technologies Corporation
- Molded body, method for producing the body and use thereof13 Aug 2013US 8,506,833 B2Karlsruhe Institute of Technology
- Detecting, measuring and controlling particles and electromagnetic radiation21 Aug 2012US 8,247,214 B2Izon Science Limited
- Glass-free dielectric layers for printed circuit boards15 Aug 2019US 2019/0248970 A1International Business Machines Corporation
- Apparatus and method for cutting multilayer material4 Apr 2019US 2019/0099993 A1Industrial Technology Research Institute
- Process of treating a workpiece using a liquid jet guided laser beam2 Aug 2018US 2018/0214982 A1Synova SA
- Rotatable manifold cutter for use in portioning3 Aug 2017US 2017/0217044 A1John Bean Technologies Corporation
- Rotatable manifold cutter for use in portioning26 Feb 2015US 2015/0053058 A1John Bean Technologies Corporation
Most cited
By later US patents
- Method for producing via holes in polymer dielectrics127US 4,764,485 AGeneral Electric Company · 1988
- Apparatus for perforating oil and gas wells78US 4,282,940 AMagnafrac · 1981
- Method of making microporous filter membrane44US 7,784,619 B2Baxter International Inc. · 2010
- Plastic bag and closed plastic bag with laser-formed venting perforations40US 4,743,123 AWavin B. V. · 1988
- Laser drilling processes for forming an apertured film39US 5,916,462 A1999