Glass-free dielectric layers for printed circuit boards
AssigneeInternational Business Machines Corporation
InventorsJoseph Kuczynski, Jason T. Wertz, Bruce J. Chamberlin, Sarah K. Czaplewski-Campbell, Jing Zhang
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Abstract
According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.
Claims18
A glass-free pre-impregnated material comprising:
- a perforated polybenzimidazole (PBI) sheet;
- and
- a partially cured resin encapsulating the PBI sheet, the partially cured resin further at least partially filling perforations of the PBI sheet.
A process of forming a glass-free pre-impregnated material, the process comprising:
- encapsulating a perforated polybenzimidazole (PBI) sheet within a resin;
- at least partially filling perforations of the PBI sheet with the resin, and
- partially curing the resin to form a-the glass-free pre-impregnated material.
A printed circuit board comprising a glass-free dielectric layer, the glass-free dielectric layer including a perforated polybenzimidazole (PBI) sheet encapsulated within a cured resin,, the partially cured resin further at least partially filling perforations of the PBI sheet.
Dependencies are inferred from the claim text.