Apparatus and method for cutting multilayer material

An apparatus for cutting a multilayer material, comprising:

• a splitter module, located on a transmission path of an incident light beam, being to split the incident light beam into a first polarized light beam and a second polarized light beam;
• and
• a uniaxial crystal element, located close to the splitter module, having an optical axis perpendicular to a normal line of the uniaxial crystal element;
• wherein the uniaxial crystal element is located on both transmission paths of the first polarized light beam and the second polarized light beam, the first polarized light beam and the second polarized light beam pass through the uniaxial crystal element individually by having the first polarized light beam corresponding to a first refractive index and the second polarized light beam corresponding to a second refractive index different to the first refractive index, thus the first polarized light beam has a first focus, the second polarized light beam has a second focus, and a focal length of the first focus is different to that of the second focus.