B24B 47/22
Equipment for exact control of the position of the grinding tool or
Official title: Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
B24B47/22 (Equipment for exact control of the position of the grinding tool or) appears on 229 US grants and 154 published applications in this corpus.
Search patents in B24B- Granted patents
- 229
- Published applications
- 154
- Assignees
- 135
- Inventors
- 443
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 5 | 0 |
| 1994 | 8 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 10 | 0 |
| 1999 | 5 | 0 |
| 2000 | 9 | 0 |
| 2001 | 15 | 4 |
| 2002 | 9 | 7 |
| 2003 | 10 | 11 |
| 2004 | 5 | 8 |
| 2005 | 15 | 8 |
| 2006 | 10 | 10 |
| 2007 | 7 | 4 |
| 2008 | 5 | 3 |
| 2009 | 1 | 9 |
| 2010 | 2 | 4 |
| 2011 | 4 | 4 |
| 2012 | 4 | 4 |
| 2013 | 6 | 3 |
| 2014 | 3 | 7 |
| 2015 | 3 | 8 |
| 2016 | 3 | 3 |
| 2017 | 7 | 3 |
| 2018 | 7 | 3 |
| 2019 | 6 | 5 |
| 2020 | 2 | 7 |
| 2021 | 0 | 9 |
| 2022 | 2 | 6 |
| 2023 | 3 | 7 |
| 2024 | 6 | 10 |
| 2025 | 5 | 2 |
| 2026 | 4 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Robotic polishing system and method for using same18 Aug 2026US 12,708,976 B2Pratt & Whitney Canada Corp.
- Method for controlling and/or monitoring a workpiece machining process2 Jun 2026US 12,643,197 B2Pro-Micron GmbH
- Grinding method for slice wafer7 Apr 2026US 12,594,640 B2Disco Corporation
- System for marking a coated ophthalmic lens20 Jan 2026US 12,528,262 B2Transitions Optical, Inc.
- Processing apparatus for brittle plate and processing method for brittle plate26 Aug 2025US 12,397,393 B2Bando Kiko Co., Ltd.
- Grinding apparatus, inclination adjusting method, and information display20 Aug 2026US 2026/0241512 A1Tokyo Electron Limited
- Cutting apparatus, cutting method, and method for manufacturing cut product30 Jul 2026US 2026/0216919 A1Towa Corporation
- Edge grinding machine and grinding adjusting method of edge grinding machine30 Apr 2026US 2026/0115852 A1Delta Electronics, Inc.
- Chip grinding device and grinding method5 Mar 2026US 2026/0061555 A1
- Grinding processing apparatus8 Jan 2026US 2026/0008153 A1Niterra Materials Co., Ltd.
Most cited
By later US patents
- Automatic wafer lapping apparatus88US 5,333,413 AShin-Etsu Handotai Co., Ltd. · 1994
- Wafer carrier for semiconductor wafer polishing machine63US 5,916,015 ASpeedfam Corporation · 1999
- Machine tool apparatus and linear motion track therefor54US 5,472,367 AOMAX Corporation · 1995
- Automated wafer lapping system53US 5,679,055 AMEMC Electronic Materials, Inc. · 1997
- Lens periphery processing apparatus, method for obtaining processing data, and lens periphery processing method43US 5,347,762 ANidek Co., Ltd. · 1994