B24B 27/0675
Methods therefor
Official title: {methods therefor}
B24B27/0675 (Methods therefor) appears on 29 US grants and 35 published applications in this corpus.
Search patents in B24B- Granted patents
- 29
- Published applications
- 35
- Assignees
- 18
- Inventors
- 60
- Latest grant
- 7 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 2 |
| 2003 | 3 | 4 |
| 2004 | 2 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 4 |
| 2013 | 2 | 1 |
| 2014 | 2 | 2 |
| 2015 | 2 | 1 |
| 2016 | 1 | 0 |
| 2017 | 2 | 1 |
| 2018 | 1 | 5 |
| 2019 | 1 | 0 |
| 2020 | 2 | 0 |
| 2021 | 2 | 1 |
| 2022 | 0 | 8 |
| 2023 | 1 | 0 |
| 2024 | 3 | 0 |
| 2025 | 1 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer processing method7 Jan 2025US 12,186,857 B2Disco Corporation
- Automatic chuck apparatus, grinding wheel cutting apparatus and cutting method26 Nov 2024US 12,151,334 B2Biam Alloys Co., Ltd.
- Grinding wheel apparatus, grinding wheel cutting apparatus and cutting method22 Oct 2024US 12,122,015 B2Biam Alloys Co., Ltd.
- Grinding wheel cutting apparatus and cutting method23 Jul 2024US 12,042,897 B2Biam Alloys Co., Ltd.
- Apparatus and method for cutoff machining sintered magnet18 Jul 2023US 11,701,748 B2Shin-Etsu Chemical Co., Ltd.
- Grinding wheel, method for grinding workpiece, and method for manufacturing chip1 Oct 2026US 2026/0295760 A1Disco Corporation
- Braking method for power tools21 May 2026US 2026/0138229 A1Hilti Aktiengesellschaft
- Semiconductor Crystal Wafer Manufacturing Device and Manufacturing Method8 May 2025US 2025/0144845 A1DryChemicals Co., Ltd.
- Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline silicon rod cutting device14 Jul 2022US 2022/0219287 A1Tokuyama Corporation
- Edge trimming method16 Jun 2022US 2022/0184768 A1Disco Corporation
Most cited
By later US patents
- High-security CD disk erasure process, and portable machine for accomplishing high-speed, high-security CD disk erasure34US 6,334,582 B12002
- Method and apparatus for sawing bar-shaped workpieces into slices15US 4,991,475 AWacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH · 1991
- High-security data removal process for data-containing disks, portable machine for high-speed, high security disk data removal, and DVD splitting process and apparatus13US 6,685,119 B22004
- High-security data removal process for data-containing disks, portable machine for high-speed, high-security disk removal, and DVD splitting process and apparatus6US 6,585,177 B22003
- High-security data removal process for data-containing disks, portable machine for high-speed, high-security disk data removal, and DVD splitting process and apparatus6US 6,588,687 B22003