B23K 35/3616
Halogen compounds
Official title: {Halogen compounds}
B23K35/3616 (Halogen compounds) appears on 58 US grants and 46 published applications in this corpus.
Search patents in B23K- Granted patents
- 58
- Published applications
- 46
- Assignees
- 46
- Inventors
- 173
- Latest grant
- 25 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 4 |
| 2002 | 1 | 3 |
| 2003 | 2 | 3 |
| 2004 | 2 | 2 |
| 2005 | 2 | 1 |
| 2006 | 2 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 2 | 0 |
| 2011 | 0 | 3 |
| 2012 | 1 | 1 |
| 2013 | 1 | 4 |
| 2014 | 0 | 0 |
| 2015 | 1 | 1 |
| 2016 | 1 | 3 |
| 2017 | 3 | 3 |
| 2018 | 2 | 2 |
| 2019 | 1 | 3 |
| 2020 | 4 | 2 |
| 2021 | 1 | 3 |
| 2022 | 1 | 1 |
| 2023 | 3 | 3 |
| 2024 | 3 | 1 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Flux and solder paste25 Nov 2025US 12,479,051 B2Senju Metal Industry Co., Ltd.
- Flux, resin flux cored solder using the flux, and soldering method24 Dec 2024US 12,172,243 B2Senju Metal Industry Co., Ltd.
- Brazing material, brazing member, heat exchanger, and producing method of brazing member1 Oct 2024US 12,103,115 B2Harima Chemicals, Inc.
- Flux for resin-cored solder, resin-cored solder, and soldering method25 Jun 2024US 12,017,307 B2Denso Corporation
- Flux and solder material5 Dec 2023US 11,833,621 B2Koki Company Limited
- Flux and solder paste14 Aug 2025US 2025/0256362 A1Senju Metal Industry Co., Ltd.
- Flux for Resin-Cored Solder, Resin-Cored Solder, and Soldering Method1 Feb 2024US 2024/0033863 A1Denso Corporation
- Printable surface treatment for aluminum bonding29 Jun 2023US 2023/0201945 A1Averatek Corporation
- Liquid metal paste containing metal particle additive22 Jun 2023US 2023/0197558 A1Indium Corporation
- Flux and Solder Material30 Mar 2023US 2023/0103270 A2Koki Company Limited
Most cited
By later US patents
- Flux cored arc welding electrode53US 5,369,244 AThe Lincoln Electric Company · 1994
- Low hydrogen basic metal cored electrode37US 5,055,655 AThe Lincoln Electric Company · 1991
- Basic metal cored electrode35US 5,003,155 AThe Lincoln Electric Company · 1991
- Basic metal cored electrode35US 5,225,661 AThe Lincoln Electric Company · 1993
- Lead-free solder composition with Bi, In and Sn30US 6,184,475 B2Fujitsu Limited · 2001