Liquid metal paste containing metal particle additive
AssigneeIndium Corporation
InventorsGuangyu Fan, Ross Berntson
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Abstract
Some implementations of the disclosure are directed to liquid metal pastes that can be used as thermal interface materials. In one implementation, a liquid metal paste configured to be applied as a thermal interface material between electronic components, includes: 92.5 wt % of 99.9 wt % of a liquid gallium or liquid gallium alloy; and 0.1 wt % to 7.5 wt % of a powder of metal particles, the metal particles including Ag, Au, Cu, W, Ti, Cr, Ni, Cu or Ni. The liquid metal paste can also include an organic compound coating a surface of the metal particles, the organic compound configured to prevent the metal particles from forming an intermetallic compound with the liquid gallium or liquid gallium alloy.
Claims20
A liquid metal paste configured to be applied as a thermal interface material between electronic components, the liquid metal paste comprising:
- 92.5 wt % to 99.9 wt % of a liquid gallium or liquid gallium alloy;
- and
- 0.1 wt % to 7.5 wt % of a powder of metal particles, the metal particles comprising Ag, Au, Cu, W, Ti, Cr, Ni, Cu or Ni.
The liquid metal paste 9, wherein the liquid gallium alloy comprises eutectic GaIn or eutectic GaInSn.
An assembly, comprising:
- a heat generating device;
- a heat transferring device;
- and
- a thermal interface between surfaces of the heat generating device and heat transferring device, wherein the thermal interface is formed by applying a liquid metal paste comprising:
- 92.5 wt % to 99.9 wt % of a liquid gallium or liquid gallium alloy;
- 0.1 wt % to 7.5 wt % of a powder of metal particles, the metal particles comprising Ag, Au, Cu, W, Ti, Cr, Ni, Cu or Ni;
- and optionally, an organic compound coating a surface of the metal particles.
A method, comprising:
- applying a liquid metal paste between a heat generating device and a heat transferring device to form an assembly having the liquid metal paste in touching relation with a surface of the heat generating device, or in touching relation with a surface of the heat transferring device, the liquid metal paste comprising 92.5 wt % to 99.9 wt % of a liquid gallium or liquid gallium alloy;
- 0.1 wt % to 7.5 wt % of a powder of metal particles, the metal particles comprising Ag, Au, Cu, W, Ti, Cr, Ni, Cu or Ni;
- and optionally, an organic compound coating a surface of the metal particles, wherein
- the liquid metal paste acts as a thermal interface material configured to transfer heat from the heat generating device to the heat transferring device.
Dependencies are inferred from the claim text.