B23K 2103/12
Copper or alloys thereof
B23K2103/12 (Copper or alloys thereof) appears on 845 US grants and 1,157 published applications in this corpus.
Search patents in B23K- Granted patents
- 845
- Published applications
- 1,157
- Assignees
- 652
- Inventors
- 2,630
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 7 | 0 |
| 1997 | 12 | 0 |
| 1998 | 7 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 11 | 2 |
| 2002 | 18 | 21 |
| 2003 | 17 | 23 |
| 2004 | 21 | 27 |
| 2005 | 9 | 30 |
| 2006 | 15 | 29 |
| 2007 | 7 | 26 |
| 2008 | 9 | 20 |
| 2009 | 8 | 31 |
| 2010 | 12 | 25 |
| 2011 | 20 | 28 |
| 2012 | 18 | 45 |
| 2013 | 23 | 31 |
| 2014 | 25 | 37 |
| 2015 | 24 | 47 |
| 2016 | 30 | 74 |
| 2017 | 35 | 65 |
| 2018 | 43 | 61 |
| 2019 | 64 | 79 |
| 2020 | 48 | 64 |
| 2021 | 60 | 68 |
| 2022 | 42 | 100 |
| 2023 | 45 | 80 |
| 2024 | 64 | 63 |
| 2025 | 52 | 46 |
| 2026 | 32 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solid-state joining method, solid-state joined joint, solid-state joined structure, and solid-state joining device29 Sep 2026US 12,746,616 B2Osaka University
- Welding method and welding apparatus22 Sep 2026US 12,741,337 B2Furukawa Electric Co., Ltd.
- Copper-tin-nickel brazing material prepared by alloys recycled from E-waste, preparation method therefor and system thereof15 Sep 2026US 12,735,765 B2Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.
- Linear friction-joining method and linear friction-joining structure8 Sep 2026US 12,728,477 B2Osaka University
- Laser control structure and laser bonding method using the same25 Aug 2026US 12,715,070 B2Electronics and Telecommunications Research Institute
- Mounting pin holders using a laser welding process8 Oct 2026US 2026/0307182 A1Shenzhen STS Microelectronics Co., Ltd.
- Secondary Battery and Method for Joining Electrode Lead1 Oct 2026US 2026/0302555 A1LG Energy Solution, Ltd.
- Method of manufacturing busbar3 Sep 2026US 2026/0260780 A1Furukawa Electric Co., Ltd.
- Welding device and electrode assembly manufactured using the welding device27 Aug 2026US 2026/0249382 A1Samsung SDI.Co., Ltd.
- Conductor joining method27 Aug 2026US 2026/0249386 A1Honda Motor Co., Ltd.
Most cited
By later US patents
- Forming structures from CAD solid models580US 6,391,251 B1Optomec Design Company · 2002
- Additive manufacturing of active devices using dielectric, conductive and magnetic materials323US 10,254,499 B1Southern Methodist University · 2019
- Forming structures from CAD solid models321US 6,811,744 B2Optomec Design Company · 2004
- Ultraviolet laser system and method for forming vias in multi-layered targets258US 5,593,606 AElectro Scientific Industries, Inc. · 1997
- Simulated laser spot enlargement150US 6,706,998 B2Electro Scientific Industries, Inc. · 2004