Solid-state joining method, solid-state joined joint, solid-state joined structure, and solid-state joining device

A solid-state joining method, comprising:

• bringing end portions of one material to be joined and the other material to be joined into contact with one another to form an interface to be joined;
• applying a pressure to the interface to be joined in a direction perpendicular to the interface to be joined, wherein the pressure is set to be equal to or higher than a yield strength of the one material to be joined and/or the other material to be joined at a desired joining temperature;
• increasing a temperature in the vicinity of the interface to be joined to the desired joining temperature by using an external heating means which is energization heating while the pressure is applied perpendicular to the interface to be joined;
• and
• plastically deforming the interface to be joined to discharge burrs and form a solid-state joined interface,
• wherein a plate thickness of the end portion of the one material to be joined and/or the other material to be joined is reduced toward a side where the discharge of the burrs is suppressed,
• at the time when the temperature just reaches the desired joining temperature, the interface to be joined is deformed so that the solid-state joined interface is formed, and
• a rotation mechanism of a friction welding device and a linear sliding mechanism of a linear friction welding are not involved in the solid-state joining method.