B23D 57/0023
With a plurality of saw wires or saw wires having plural cutting
Official title: {with a plurality of saw wires or saw wires having plural cutting zones}
B23D57/0023 (With a plurality of saw wires or saw wires having plural cutting) appears on 45 US grants and 43 published applications in this corpus.
Search patents in B23D- Granted patents
- 45
- Published applications
- 43
- Assignees
- 35
- Inventors
- 116
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 1 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 3 |
| 2011 | 1 | 4 |
| 2012 | 1 | 3 |
| 2013 | 3 | 3 |
| 2014 | 3 | 4 |
| 2015 | 1 | 4 |
| 2016 | 4 | 0 |
| 2017 | 2 | 0 |
| 2018 | 1 | 1 |
| 2019 | 1 | 2 |
| 2020 | 1 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 7 |
| 2024 | 0 | 2 |
| 2025 | 7 | 2 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for controlling wafer breakage during ingot slicing operations5 May 2026US 12,617,032 B2GlobalWafers Co., Ltd.
- Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes25 Nov 2025US 12,479,129 B2Siltronic AG
- Method for cutting a shell-type object, a cutter system and a vessel equipped with the cutter system7 Oct 2025US 12,434,312 B2Advantis A/S
- Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes10 Jun 2025US 12,325,081 B2Siltronic AG
- Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes27 May 2025US 12,311,455 B2Siltronic AG
- Continuous cutting horizontal multi-wire stone cutting machine21 May 2026US 2026/0138306 A1Rock-It Natural Stone, Inc.
- Silicon Rod Cutting System7 May 2026US 2026/0124789 A1Qingdao Gaoce Technology Co., Ltd
- Cutting device and multi-wire cutting machine including cutting device20 Feb 2025US 2025/0058500 A1Hunan Yiyuan New Material Technology Co., Ltd
- Systems and methods for controlling wafer breakage during ingot slicing operations23 Jan 2025US 2025/0025951 A1GlobalWafers Co., Ltd.
- Wire saw abnormality diagnosis device and method26 Sep 2024US 2024/0316664 A1Komatsu Ntc Ltd.
Most cited
By later US patents
- Cable saw for tree harvesting apparatus39US 4,273,169 AJ. I. Case Company · 1981
- Wire saw for and method of cutting off slices from a workpiece19US 5,771,876 AWacker Siltronic Gesellschaft fur Halbleitermaterialien AG · 1998
- Articulating band saw and method19US 8,475,081 B2Tetra Technologies, Inc. · 2013
- Method of cutting and removing nuclear reactor18US 5,329,562 AKabushiki Kaisha Dymosha · 1994
- Method and apparatus for dicing semiconductor wafers12US 5,609,148 AKabushiki Kaisha Toshiba · 1997