Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processes
AssigneeSiltronic AG
InventorsAxel Beyer, Carl Frintert, Peter Wiesner
Life of this patent
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AssigneeSiltronic AG
InventorsAxel Beyer, Carl Frintert, Peter Wiesner
Estimating the term…
A method uses a wire saw to cut slices from a workpiece. The wire saw has an array of saw wire tensioned in a plane between two rollers supported between fixed and floating bearings. During a cut-off operation, the workpiece is fed through the wire array with simultaneous axial movement of the floating bearings by adjusting the temperature of the fixed bearings with a cooling fluid in accordance with the temperature of the cooling fluid being in dependence on a depth of cut and correlating with a first correction profile, which specifies the travel of the floating bearings in dependence on the depth of cut. Also, the workpiece is fed through the wire array while simultaneously moving the workpiece along the workpiece axis in accordance with a second correction profile, specifying the travel of the workpiece. The first and second correction profiles are opposed to a shape deviation.
A method for cutting a multiplicity of slices, using a wire saw, from workpieces during a sequence of cut-off operations, which are divided into initial cuts and follow-on cuts, the wire saw comprising a wire array of moveable wire sections of a saw wire and an actuating device, and the wire array being tensioned in a plane between two wire guide rollers, each of the two wire guide rollers being supported between a fixed bearing and a floating bearing, the method comprising:
Dependencies are inferred from the claim text.