Solueta
Hwaseong-si, KR· latest recorded location
SOLUETA is named on 7 US grants and 8 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 7
- Published applications
- 8
- Inventors
- 8
- Granted in 2026 so far
- 0
- Most recent grant
- 19 Mar 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 0 | 2 |
| 2015 | 2 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 4 |
| 2021 | 1 | 1 |
| 2022 | 2 | 0 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
By publication year.
Technology areas
Share of 15 documents
- H05KPrinted circuits9
- Y10TTechnical subjects covered by former us classification7
- B22FWorking metallic powder6
- B32BLayered products, i.e. products built-up of strata of flat or non-flat5
- C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients4
- C09JAdhesives4
- C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys4
- H01GCapacitors4
- B82YSpecific uses or applications of nanostructures2
- C22CAlloys2
Recent patents
- Highly heat-dissipating flexible printed circuit board (GFPCB), manufacturing method therefor, and LED lamp for vehicle19 Mar 2024US 11,937,364 B2
- High heat dissipating thin film and method for manufacturing same17 Oct 2023US 11,787,157 B2
- Copper alloy production method and method for manufacturing foil from copper alloy9 Aug 2022US 11,408,055 B2
- Method for producing nickel nanopowder1 Mar 2022US 11,260,452 B2
- Method for preparing nickel nanopowders and method for making nickel nanopowders into paste17 Aug 2021US 11,090,722 B2
- Highly heat-dissipating flexible printed circuit board (gfpcb), manufacturing method therefor, and led lamp for vehicle14 Oct 2021US 2021/0321509 A1
- Method for producing nickel nanopowder18 Jun 2020US 2020/0189003 A1
- Method for preparing nickel nanopowders and method for making nickel nanopowders into paste18 Jun 2020US 2020/0189004 A1
- High heat dissipating thin film and method for manufacturing same14 May 2020US 2020/0147929 A1
- Copper alloy production method and method for manufacturing foil from copper alloy23 Jan 2020US 2020/0024690 A1
Most cited
By later US patents
- Highly heat-dissipating flexible printed circuit board (GFPCB), manufacturing method therefor, and LED lamp for vehicle1US 11,937,364 B22024
- Heat dissipating tape using conductive fiber and method for manufacturing same1US 8,951,629 B22015
- Horizontal thermoelectric tape and method for manufacturing same1US 8,968,867 B22015